Electrostatic chuck and substrate processing apparatus
AssigneeNGK Insulators, Ltd.
InventorsHideyoshi Tsuruta, Satoru Yamada, Kiyoshi Nashimoto, Naoki Miyazaki
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AssigneeNGK Insulators, Ltd.
InventorsHideyoshi Tsuruta, Satoru Yamada, Kiyoshi Nashimoto, Naoki Miyazaki
Estimating the term…
An electrostatic chuck having an insulation layer includes a mount plane on which a wafer is mounted, an inner electrode provide in the insulation layer, and projecting portions protruded from the mount plane which include contact planes to be contacted to the wafer. A backside gas is flowed into a space defined by the mount plane, the projecting portions, and the wafer under such a condition that the wafer is attracted to the mount plane so as to maintain a temperature uniformity of the wafer. A total amount of areas of the contact planes of the projecting portions is not less than 5% and not more than 10% with respect to an area of the inner electrode, and heights of the projecting portions are not less than 5 μm and not more than 10 μm.
An electrostatic chuck having an insulation layer including a mount plane on which a wafer is mounted, an inner electrode provide in the insulation layer, and projecting portions protruded from the mount plane which include contact planes to be contacted to the wafer, wherein a backside gas is flowed in a space defined by the mount plane, the projecting portions, and the wafer under such a condition that the wafer is attracted to the mount plane so as to maintain a temperature uniformity of the wafer, comprising a construction such that a total amount of areas of the contact planes of the projecting portions is not less than 5% and not more than 10% with respect to an area of the inner electrode, and heights of the projecting portions are not less than 5 μm and not more than 10 μm.
Dependencies are inferred from the claim text.