Head slider supporting device, disk device and suspension

A head slider supporting device comprising:

• a suspension, a head IC chip mounting portion being provided on a first surface of said suspension;
• a head slider loaded on said first surface of said suspension at an extending end thereof, said head slider integrally including a head;
• a head IC chip mounted at said head IC chip mounting portion of said suspension;
• and
• wiring patterns extending along said suspension from a portion of said suspension, at which portion said head slider is loaded, via said head IC chip mounting portion,
• wherein said head IC chip is mounted at said head IC chip mounting portion in a condition in which said head IC chip is lowered so that an amount of projecting of said head IC chip from said first surface of said suspension is smaller than the thickness of said head IC chip.

A disk device, comprising:

• an actuator;
• a disk which is rotated;
• an arm which is driven by said actuator;
• and
• a head slider supporting device, which is rotated integrally with said arm, said head slider supporting device comprising:
• a head slider having a head loaded thereon;
• a head IC which controls said head;
• a substantially flat supporting member having a portion at which said head slider is mounted and a head IC loading portion at which said head IC is loaded;
• and
• wires electrically connecting said head slider and said head IC,
• wherein said head IC is mounted at said head IC mounting portion in a condition in which said head IC projects from one surface of said supporting member so that an amount of projecting of said head IC from said one surface of said supporting member is smaller than the thickness of said head IC.

A disk device, comprising:

• an actuator;
• a disk which is rotated;
• an arm which is driven by said actuator;
• and
• a head slider supporting device, which is rotated integrally with said arm, said head slider supporting device comprising:
• a suspension, a head IC chip mounting portion being provided on one surface of said suspension;
• a head slider loaded on said one surface of said suspension at an extending end thereof, said head slider integrally including a head;
• a head IC chip mounted at said head IC chip mounting portion of said suspension;
• and
• wiring patterns extending along said suspension from a portion of said suspension, at which portion said head slider is loaded, via said head IC chip mounting portion,
• wherein said head IC chip is mounted at said head IC chip mounting portion in a condition in which said head IC chip is lowered so that an amount of projecting of said head IC chip from said one surface of said suspension is smaller than the thickness of said head IC chip.

A suspension, having an extending end and the other end, a head IC chip mounting portion being provided between said extending end and said other end thereof, wherein:

• a head slider is loaded on said suspension at said extending end thereof, said head slider integrally including a head;
• a head IC chip is mounted at said head IC chip mounting portion of said suspension;
• first wiring patterns extend along said suspension between a portion of said suspension, at which portion said head slider is loaded, and said head IC chip mounting portion;
• and
• second wiring patterns extend along said suspension from said head IC chip mounting portion,
• wherein said head IC chip is mounted at said head IC chip mounting portion in a condition in which said head IC chip projects from one surface of said suspension so that an amount of projecting of said head IC chip from said one surface of said suspension is smaller than the thickness of said head IC chip.

A head slider supporting device comprising:

• a suspension, having an extending end and the other end, having a fixing portion on the side of said other end, and having a head IC chip mounting portion at said fixing portion;
• a head slider loaded on a first surface of said suspension at said extending end thereof, said head slider integrally including a head;
• a head IC chip mounted at said head IC chip mounting portion of said suspension;
• wiring patterns extending along said suspension from a portion of said suspension, at which portion said head slider is loaded, to said head IC chip mounting portion, and further extending from said head IC chip mounting portion;
• and
• a plate-shaped junction member, on which said fixing portion of said suspension is mounted;
• wherein:
• both sides of said head IC chip mounting portion are cut, and, also, a center of said head IC chip mounting portion is cut in a direction perpendicular to a direction in which said both sides of said head IC chip mounting portion are cut so that said head IC chip mounting portion is divided into two parts, and middle portions of said two parts of said head IC chip mounting portion project on the side of a second surface of said suspension, which second surface is opposite to said first surface, said head IC chip being mounted on, so as to extend over, said middle portions of said two parts of said head IC chip mounting portion on surfaces thereof on the side of said first surface of said suspension;
• said wiring patterns reach said middle portions via slope portions which are formed at both the ends of said head IC chip mounting portion when said middle portions project on the side of said second surface, and pad terminals which terminate said wiring patterns, respectively, are provided on said middle portions;
• and
• said junction member has an opening in which said head IC chip mounting portion at which said head IC chip is mounted is inserted.

A head slider supporting device comprising:

• a suspension, having an extending end and the other end, having a fixing portion at said other end, and having a head IC chip mounting portion at said fixing portion;
• a head slider loaded on a first surface of said suspension at said extending end thereof, said head slider integrally including a head;
• a head IC chip mounted at said head IC chip mounting portion of said suspension;
• wiring patterns extending along said suspension from a portion of said suspension, at which portion said head slider is loaded, to said head IC chip mounting portion, and further extending from said head IC chip mounting portion;
• and
• a plate-shaped junction member, on which said fixing portion of said suspension is mounted,
• wherein:
• both sides of said head IC chip mounting portion are cut, and, also, one end of said head IC chip mounting portion is cut in a direction perpendicular to a direction in which said both sides of said head IC chip mounting portion are cut so that an opening is formed but a thin connection portion is left which bridges said opening, a middle portion of said head IC chip mounting portion projecting on the side of a second surface of said suspension, which second surface is opposite to said first surface, said head Id chip being mounted on said middle portion of said head IC chip mounting portion on a surface thereof on the side of said first surface of said suspension;
• said wiring patterns reach said middle portion via a slope portion which is formed at the other end of said head IC chip mounting portion when said middle portion projects from said second surface, and pad terminals which terminate said wiring patterns, respectively, are provided on said middle portion;
• and
• said junction member has an opening, in which said head IC chip mounting portion at which said head IC chip is mounted is inserted.

A head slider supporting device comprising:

• a suspension, having a first surface and a second surface opposite to said first surface, and having a head IC chip mounting portion on said second surface;
• a head slider loaded on said first surface of said suspension at an extending end thereof, said head slider integrally including a head;
• a head IC chip mounted at said head IC chip mounting portion of said suspension;
• and
• wiring patterns extending on said first surface of said suspension from a portion of said suspension, at which portion said head slider is loaded, via said head IC chip mounting portion;
• wherein:
• said suspension includes a metal plate body and a base layer formed on said metal plate body, said wiring patterns being formed on said base layer;
• said head IC chip mounting portion includes an opening formed in said metal plate body and having a size corresponding to said head IC chip, said base layer covering said opening on the side of said first surface, and pad terminals which terminate said wiring patterns, respectively, are exposed on a surface of said base layer on the side of the second surface of said suspension;
• and
• said head IC chip is mounted at said head IC chip mounting portion so that said head IC chip is fitted into said opening of said metal plate body from the side of said second surface.

A head slider supporting device comprising:

• a suspension, having an extending end and the other end, having a first surface and a second surface opposite to said first surface, having a fixing portion on the side of said other end, and having a head IC chip mounting portion at said fixing portion;
• a head slider loaded on said first surface of said suspension at said extending end thereof, said head slider integrally including a head;
• a head IC chip mounted at said head IC chip mounting portion of said suspension;
• wiring patterns extending on said first surface of said suspension from a portion of said suspension, at which portion said head slider is loaded, to said head IC chip mounting portion, and further extending from said head IC chip mounting portion;
• and
• a plate-shaped junction member on which said fixing portion of said suspension is mounted,
• wherein:
• said suspension includes a metal plate body and a base layer formed on said metal plate body, said wiring patterns being formed on said base layer;
• said head IC chip mounting portion includes an opening formed in said metal plate body and having a size corresponding to said head IC chip, said base layer covering said opening on the side of said first surface, and pad terminals which terminate said wiring patterns, respectively, are exposed on a surface of said base layer on the side of the second surface of said suspension;
• said head IC chip is mounted at said head IC chip mounting portion so that said head IC chip is fitted into said opening of said metal plate body from the side of said second surface;
• and
• said junction member has an opening, in which said head IC chip mounted at said head IC chip mounting portion is inserted.

A disk device, comprising:

• an actuator;
• a disk which is rotated;
• an arm which is driven by said actuator;
• and
• a head slider supporting device, which is rotated integrally with said arm, said head slider supporting device comprising:
• a suspension, a head IC chip mounting portion being provided on a first surface of said suspension;
• a head slider loaded on said first surface of said suspension at an extending end thereof, said head slider integrally including a head;
• a head IC chip mounted at said head IC chip mounting portion of said suspension;
• and
• wiring patterns extending along said suspension from a portion of said suspension, at which portion said head slider is loaded, through said head IC chip mounting portion,
• wherein:
• both sides of said head IC chip mounting portion are cut, and, also, a center of said head IC chip mounting portion is cut in a direction perpendicular to a direction in which said both sides of said head IC chip mounting portion are cut so that said head IC chip mounting portion is divided into two parts, middle portions of said two parts of said head IC chip mounting portion projecting on the side of a second surface of said suspension, which second surface is opposite to said first surface, said head IC chip being mounted on, so as to extend over, said middle portions of said two parts of said head IC chip mounting portion on surfaces thereof on the side of said first surface of said suspension;
• and
• said wiring patterns reach said middle portions via slope portions which are formed at both ends of said head IC chip mounting portion when said middle portions project on the side of said second surface, and pad terminals which terminate said wiring patterns, respectively, are provided on said middle portions.

A disk device, comprising:

• an actuator;
• a disk which is rotated;
• an arm which is driven by said actuator;
• and
• a head slider supporting device, which is rotated integrally with said arm, said head slider supporting device comprising:
• a suspension, a head IC chip mounting portion being provided on a first surface of said suspension;
• a head slider loaded on said first surface of said suspension at an extending end thereof, said head slider integrally including a head;
• a head IC chip mounted at said head IC chip mounting portion of said suspension;
• and
• wiring patterns extending along said suspension from a portion of said suspension, at which portion said head slider is loaded, through said head IC chip mounting portion,
• wherein:
• both sides of said head IC chip mounting portion are cut, and, also, one end of said head IC chip mounting portion is cut in a direction perpendicular to a direction in which said both sides of said head IC chip mounting portion are cut so that an opening is formed but a thin connection portion is left which bridges said opening, a middle portion of said head IC chip mounting portion projecting on the side of a second surface of said suspension, which second surface is opposite to said first surface, said head IC chip being mounted on said middle portion of said head IC chip mounting portion on a surface thereof on the side of said first surface of said suspension;
• and
• said wiring patterns reach said middle portion via a slope portion which is formed at the other end of said head IC chip mounting portion when said middle portion projects from said second surface, and pad terminals which terminate said wiring patterns, respectively, are provided on said middle portion.

A disk device, comprising:

• an actuator;
• a disk which is rotated;
• an arm which is driven by said actuator;
• and
• a head slider supporting device, which is rotated integrally with said arm, said head slider supporting device comprising:
• a suspension, having an extending end and the other end, having a fixing portion on the side of said other end, and having a head IC chip mounting portion at said fixing portion;
• a head slider loaded on a first surface of said suspension at said extending end thereof, said head slider integrally including a head;
• a head IC chip mounted at said head IC chip mounting portion of said suspension;
• wiring patterns extending along said suspension from a portion of said suspension, at which portion said head slider is loaded, to said head IC chip mounting portion, and further extending from said head IC chip mounting portion;
• and
• a plate-shaped junction member, on which said fixing portion of said suspension is mounted,
• wherein:
• both sides of said head IC chip mounting portion are cut, and, also, a center of said head IC chip mounting portion is cut in a direction perpendicular to a direction in which said both sides of said head IC chip mounting portion are cut so that said head IC chip mounting portion is divided into two parts, and middle portions of said two parts of said head IC chip mounting portion project on the side of a second surface of said suspension, which second surface is opposite to said first surface, said head IC chip being mounted on, so as to extend over, said middle portions of said two parts of said head IC chip mounting portion on surfaces thereof on the side of said first surface of said suspension;
• said wiring patterns reach said middle portions via slope portions which are formed at both ends of said head IC chip mounting portion when said middle portions project on the side of said second surface, and pad terminals which terminate said wiring patterns, respectively, are provided on said middle portions;
• and
• said junction member has an opening in which said head IC chip mounting portion on which said head IC chip is mounted is inserted.

A disk device, comprising:

• an actuator;
• a disk which is rotated;
• an arm which is driven by said actuator;
• and
• a head slider supporting device, which is rotated integrally with said arm, said head slider supporting device comprising:
• a suspension, having an extending end and the other end, having a fixing portion at said other end, and having a head IC chip mounting portion at said fixing portion;
• a head slider loaded on a first surface of said suspension at said extending end thereof, said head slider integrally including a head;
• a head IC chip mounted at said head IC chip mounting portion of said suspension;
• wiring patterns extending along said suspension from a portion of said suspension, at which portion said head slider is loaded, to said head IC chip mounting portion, and further extending from said head IC chip mounting portion;
• and
• a plate-shaped junction member, on which said fixing portion of said suspension is mounted,
• wherein:
• both sides of said head IC chip mounting portion are cut, and, also, one end of said head IC chip mounting portion is cut in a direction perpendicular to a direction in which said both sides of said head IC chip mounting portion are cut so that an opening is formed but a thin connection portion is left which bridges said opening, a middle portion of said head IC chip mounting portion projecting on the side of a second surface of said suspension, which second surface is opposite to said first surface, said head IC chip being mounted on said middle portion of said head IC chip mounting portion on a surface thereof on the side of said first surface of said suspension;
• said wiring patterns reach said middle portion via a slope portion which is formed at the other end of said head IC chip mounting portion when said middle portion projects from said second surface, and pad terminals which terminate said wiring patterns, respectively, are provided on said middle portion;
• and
• said junction member has an opening in which said head IC chip mounting portion on which said head IC chip is mounted is inserted.

A disk device, comprising:

• an actuator;
• a disk which is rotated;
• an arm which is driven by said actuator;
• and
• a head slider supporting device, which is rotated integrally with said arm, said head slider supporting device comprising:
• a suspension, having a first surface and a second surface opposite to said first surface, and having a head IC chip mounting portion on said second surface;
• a head slider loaded on said first surface of said suspension at said extending end thereof, said head slider integrally including a head;
• a head IC chip mounted at said head IC chip mounting portion of said suspension;
• and
• wiring patterns extending on said first surface of said suspension from a portion of said suspension, at which portion said head slider is loaded, via said head IC chip mounting portion;
• wherein:
• said suspension includes a metal plate body and a base layer formed on said metal plate body, said wiring patterns being formed on said base layer;
• said head IC chip mounting portion includes an opening formed in said metal plate body and having a size corresponding to said head IC chip, said base layer covering said opening on the side of said first surface, and pad terminals which terminate said wiring patterns, respectively, are exposed on a surface of said base layer on the side of the second surface of said suspension;
• and
• said head IC chip is mounted on said head IC chip mounting portion so that said head IC chip is fitted into said opening of said metal plate body from the side of said second surface.

A disk device, comprising:

• an actuator;
• a disk which is rotated;
• an arm which is driven by said actuator;
• and
• a head slider supporting device, which is rotated integrally with said arm, said head slider supporting device comprising:
• a suspension, having an extending end and the other end, having a first surface and a second surface opposite to said first surface, having a fixing portion on the side of said other end, and having a head IC chip mounting portion at said fixing portion;
• a head slider loaded on said first surface of said suspension at said extending end thereof, said head slider integrally including a head;
• a head IC chip mounted at said head IC chip mounting portion of said suspension;
• wiring patterns extending on said first surface of said suspension from a portion of said suspension, at which portion said head slider is loaded, to said head IC chip mounting portion, and further extending from said head IC chip mounting portion;
• and
• a plate-shaped junction member on which said fixing portion of said suspension is mounted;
• wherein:
• said suspension includes a metal plate body and a base layer formed on said metal plate body, said wiring patterns being formed on said base layer;
• said head IC chip mounting portion includes an opening formed in said metal plate body and having a size corresponding to said head IC chip, said base layer covering said opening on the side of said first surface, and pad terminals which terminate said wiring patterns, respectively, are exposed on a surface of said base layer on the side of the second surface of said suspension;
• said head IC chip is mounted on said head IC chip mounting portion so that said head IC chip is fitted into said opening of said metal plate body from the side of said second surface;
• and
• said junction member has an opening in which said head IC chip mounted on said head IC chip mounting portion is inserted. 25.

A suspension, having an extending end and the other end, having a fixing portion on the side of said other end, which portion is mounted on a junction member, and having a head IC chip mounting portion at said fixing portion,

• wherein:
• a head slider is loaded on a first surface of said suspension at said extending end thereof, said head slider integrally including a head;
• a head IC chip is mounted at said head IC chip mounting portion of said suspension;
• and
• wiring patterns extend along said suspension from a portion of said suspension, at which portion said head slider is loaded, to said head IC chip mounting portion, and further extend from said head IC chip mounting portion,
• wherein:
• both sides of said head IC chip mounting portion are cut, and, also, a center of said head IC chip mounting portion is cut in a direction perpendicular to a direction in which said both sides of said head IC chip mounting portion are cut so that said head IC chip mounting portion is divided into two parts, and middle portions of said two parts of said head IC chip mounting portion project on the side of a second surface of said suspension, which second surface is opposite to said first surface, said head IC chip being mounted on surfaces of said middle portions of said two parts of said head IC chip mounting portion on the side of said first surface of said suspension;
• and
• said wiring patterns reach said middle portions via slope portions which are formed at both ends of said head IC chip mounting portion when said middle portions project on the side of said second surface, and pad terminals which terminate said wiring patterns, respectively, are provided on said middle portions.

A suspension, having an extending end and the other end, having a fixing portion on the side of said other end, which portion is mounted on a junction member, and having a head IC chip mounting portion at said fixing portion,

• wherein:
• a head slider is loaded on a first surface of said suspension at said extending end thereof, said head slider integrally including a head;
• a head IC chip is mounted at said head IC chip mounting portion of said suspension;
• and
• wiring patterns extend along said suspension from a portion of said suspension, at which portion said head slider is loaded, to said head IC chip mounting portion, and further extend from said head IC chip mounting portion,
• wherein:
• both sides of said head IC chip mounting portion are cut, and, also, one end of said head IC chip mounting portion is cut in a direction perpendicular to a direction in which said both sides of said head IC chip mounting portion are cut so that an opening is formed but a thin connection portion is left which bridges said opening, a middle portion of said head IC chip mounting portion projecting on the side of a second surface of said suspension, which second surface is opposite to said first surface, said head IC chip being mounted on said middle portion of said head IC mounting portion on a surface thereof on the side of said first surface of said suspension;
• and
• said wiring patterns reach said middle portion via a slope portion which is formed at the other end of said head IC chip mounting portion when said middle portion projects from said second surface, and pad terminals which terminate said wiring patterns, respectively, are provided on said middle portion.

A suspension, including a metal plate body, a base layer formed on said metal plate body, and wiring patterns formed on said base layer, said suspension having an extending end and the other end, having a fixing portion on the side of said other end, which portion is mounted on a junction member, and having a head IC chip mounting portion at said fixing portion,

• wherein:
• a head slider is loaded on a first surface of said suspension at an extending end thereof, said head slider integrally including a head;
• a head IC chip is mounted at said head IC chip mounting portion of said suspension;
• wiring patterns extend on said first surface of said suspension from a portion of said suspension, at which portion said head slider is loaded, and further extend from said head IC chip mounting portion;
• and
• said head IC chip mounting portion includes an opening formed in said metal plate body and having a size corresponding to said head IC chip, said base layer covering said opening on the side of said first surface, and pad terminals which terminate said wiring patterns, respectively, are exposed on a surface of said base layer on the side of a second surface of said suspension, which second surface is opposite to said first surface.

A suspension, having a first surface and a second surface opposite to said first surface, and having a rigid portion which has a rib portion on at least one side thereof so that said rigid portion is prevented from bending, a head IC chip mounting portion being formed in said rigid portion,

• wherein:
• said head IC chip mounting portion has a head IC chip mounted thereon;
• both sides of said head IC chip mounting portion are cut, and, also, a center of said head IC chip mounting portion is cut in a direction perpendicular to a direction in which said both sides of said head IC chip mounting portion are cut so that said head IC chip mounting portion is divided into two parts, middle portions of said two parts of said head IC chip mounting portion projecting on the side of said second surface of said suspension, said head IC chip being mounted on surfaces of said middle portions of said two parts of said head IC chip mounting portion on the side of said first surface of said suspension;
• and
• said wiring patterns reach said middle portions via slope portions which are formed at both ends of said head IC chip mounting portion when said middle portions project on the side of said second surface, and pad terminals which terminate said wiring patterns, respectively, are provided on said middle portions.

A suspension, having a first surface and a second surface opposite to said first surface, and having a rigid portion which has a rib portion on at least one side thereof so that said rigid portion is prevented from bending, a head IC chip mounting portion being formed in said rigid portion,

• wherein:
• said head IC chip mounting portion has a head IC chip mounted thereon;
• both sides of said head IC chip mounting portion are cut, and, also, one end of said head IC chip mounting portion is cut in a direction perpendicular to a direction in which said both sides of said head IC chip mounting portion are cut so that an opening is formed but a thin connection portion is left which bridges said opening, a middle portion of said head IC chip mounting portion projecting on the side of said second surface of said suspension, said head IC chip being mounted on said middle portion of said head IC mounting portion on a surface thereof on the side of the first surface of said suspension;
• and
• said wiring patterns reach said middle portion via a slope portion which is formed at the other end of said head IC chip mounting portion when said middle portion projects on the side of said second surface, and pad terminals which terminate said wiring patterns, respectively, are provided on said middle portions.

A suspension, having a rigid portion which has a rib portion on at least one side thereof so that said rigid portion is prevented from bending, a head IC chip mounting portion being formed in said rigid portion,

• wherein:
• said head IC chip mounting portion has a head IC chip mounted thereon;
• and
• said head IC chip mounting portion includes an opening formed in a metal plate body and having a size corresponding to said head IC chip, a base layer covering said opening on the side of the first surface of said suspension, pad terminals which terminate said wiring patterns, respectively, being exposed on a surface of said base layer on the side of a second surface of said suspension, which second surface is opposite to said first surface.