Flexible circuit board and method of fabricating the same
AssigneeBenq Corporation
InventorsYi-Jing Leu, Chih-Ching Chen, Ming-Chung Peng
Life of this patent
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Abstract
A process of forming a flexible circuit board for ink jetting is provided. The process includes the steps of: providing an insulation tape; forming conductive traces on the insulation tape; and forming a photo-polymer layer filling between the conductive traces, wherein parts of the conductive traces are exposed to form a plurality of contacts. The material of the insulation tape can be polyimide, Teflon, polyamide, polymethylmethacrylate, polycarbonate, polyester, polyamide polyethylene-terephthalate copolymer, or any combination of the above materials. The material of the photo-polymer layer can be solder mask or polyimide.
Claims25
A method of forming a flexible circuit board for ink jetting, comprising the steps of:
- providing an insulation tape;
- forming conductive traces on the insulation tape;
- and
- forming a photo-polymer layer filling between the conductive traces, wherein parts of the conductive traces are exposed to form a plurality of contacts.
A flexible circuit board for ink jetting, comprising:
- an insulation tape as a substrate;
- conductive traces on the insulation tape;
- and
- a photo-polymer layer filling between the conductive traces, wherein parts of the conductive traces are exposed to form a plurality of contacts.
Dependencies are inferred from the claim text.