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OwnerKenji Inoue, Masahiro Nakanoinventors
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One of the object of the present invention is to provide a surface acoustic wave filter can obtain a sufficient attenuation in the elimination band while it is mounted on the face down type package. The surface acoustic wave filter of the present invention includes input/output electrodes, ground electrodes, a first resonator provided between the input/output electrodes, a second resonator provided between the input/output electrodes and the ground electrodes, and a capacitor pattern provided between the input/output electrodes and the ground electrodes. According to the present invention, a sufficient attenuation in the elimination band can be obtained, even though the inductance caused by the bonding wires is not added to the input/output electrodes. For this reason, small package can be used while high performance is obtained.
A surface acoustic wave filter comprising input/output electrodes, a ground electrode, a first resonator provided between the input/output electrodes, a second resonator provided between at least one of the input/output electrodes and the ground electrode, and a capacitor pattern provided between at least one of the input/output electrodes and the ground electrode.
A package of a face down type for a surface acoustic wave filter comprising a substrate on which the surface acoustic wave filter is to be mounted, the substrate having an input/output electrode, a ground electrode, and a capacitor pattern provided between the input/output electrode and the ground electrode.
A surface acoustic wave filter module including a surface acoustic wave filter and a package on which the surface acoustic wave filter is mounted, comprising an input/output electrode, a ground electrode, and a capacitor pattern provided between the input/output electrode and the ground electrode.
Dependencies are inferred from the claim text.