Laminate with an inside layer circuit used for multilayer printed circuit board for a high frequency circuit ,and method and device for measuring circuit impedance of the laminate with inside layer circuit

Abstract

There are provided a laminate with an inside layer circuit for use as a multilayer printed circuit board, a method for measuring a circuit impedance of the laminate, and a measuring device that enables a nondestructive impedance measurement accurately. The laminate with the inside layer circuit has a dielectric substrate, a first conductive layer disposed on an upper surface of the dielectric substrate to form a high frequency circuit, a second conductive layer disposed on a lower surface of the dielectric substrate, and a third conductive layer disposed over a first dielectric layer on the upper surface of the dielectric substrate. A test conductor is formed independently of the inside layer circuit within the first conductive layer. The test conductor has its one end exposed to an end face of the laminate such that a probe can be kept into contact with the end face to direct a high frequency signal to the test conductor with at least one of the second conductor and the third conductor both exposed to the end face being held at the ground potential.

Dependencies are inferred from the claim text.