Ultrasmall semiconductor bonding tools and method of fabrication thereof
OwnerRomain L. Billiet, Hanh T. Nguyeninventors
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Abstract
Semiconductor wire bonding tools used in the assembly and interconnection of integrated circuits (ICs) are micromolded from a mixture of ultrafine particulate materials mixed with an organic binder. Following extraction of the binder the green bonding tools are sintered during which they undergo isotropic, constant and accurately predetermined shrinkage. Hence semiconductor wire bonding tools can be produced with virtually no limit to miniaturization, thus allowing the fabrication of higher integrated semiconductor products.
Claims9
A method for producing tools or blanks for tools of reduced dimensions for use in the assembly and interconnection of semiconductor chips, comprising the steps of:
- a. providing at least one sinterable material in fine particulate form and at least one degradable organic thermoplastic material,
- b. mixing an accurately determined volume of said sinterable particulate material or materials with an accurately determined volume of said thermoplastic material or materials to form a thermoplastic compound,
- c. forming said thermoplastic compound into green semiconductor wire bonding tools or blanks,
- d. extracting substantially all of the organic thermoplastic material from said green tools or blanks and sintering the thus obtained organic-free preforms.
A method to fabricate microwire drawing dies and the microwires produced therewith.
A method f or increased integration of electronic circuits on semiconductor microchips by allowing the use of bonding wire of less than 20 micrometers in diameter and bond pads of less than 15 micrometer by 15 micrometer and placed at a distance of less than 15 micrometer from each other and the products made therewith.
Dependencies are inferred from the claim text.