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US 2002/0158366 A1Published application
Liquid transfer molding system for encapsulating semiconductor integrated circuits
AssigneeInfineon Technologies North America Corp.
InventorHARYANTO CHANDRA
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Abstract
An encapsulation system is used to encapsulate semiconductor products. A bottom mold unit includes a mold pot and a mold piston. A substrate loader loads a substrate into a cavity in the bottom mold unit. A liquid dispenser dispenses encapsulation material into the mold pot. The encapsulation material is in an uncured liquid state when placed into the mold pot. A top mold unit is clamped to the bottom mold unit.
Claims10
An encapsulation system for encapsulating semiconductor products, the encapsulation system comprising:
- a top mold unit;
- a bottom mold unit, the bottom mold unit including,
- a mold pot, and
- a mold piston,
- a substrate loader, for loading a substrate into a cavity in the bottom mold unit;
- and,
- a liquid dispenser for dispensing encapsulation material into the mold pot, the encapsulation material being in an uncured liquid state when placed into the mold pot.
4 more elements
A method for encapsulating semiconductor products, the method comprising the following steps:
- (a) placing a substrate within a cavity in a bottom mold unit;
- (b) dispensing encapsulation material into a mold pot within the bottom mold unit, the encapsulation material being in an uncured liquid state when placed into the mold pot;
- (c) clamping the bottom mold unit to the top mold unit;
- and,
- (d) transferring the encapsulation material to the cavity in the bottom mold unit.
2 more elements
Dependencies are inferred from the claim text.