Microelectronic device having signal distribution functionality on an interfacial layer thereof
AssigneeIntel Corporation
InventorsQuat T. Vu, Tuy T. Ton, Steven Towle
Life of this patent
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Abstract
A microelectronic device includes a microelectronic die having an interfacial metal layer deposited over an active surface thereof to perform a signal distribution function within the device. The microelectronic die is fixed within a package core to form a die/core assembly. One or more metallization layers may then be built up over the die/core assembly as part of a packaging scheme. The interfacial metal layer can be applied either before or after the die is fixed within the package core. In one approach, the interfacial layer is applied during wafer-level processing.
Claims26
A microelectronic device comprising:
- a microelectronic die having a plurality of bond pads on an active surface thereof, said microelectronic die being fixed within an opening in a package core;
- and
- an interfacial metal layer deposited over said active surface of said microelectronic die, said interfacial metal layer having at least one conductive element that is conductively coupled to multiple bond pads on said active surface of said microelectronic die to provide signal distribution between points within said microelectronic die.
A microelectronic device comprising:
- at least one microelectronic die having a plurality of bond pads on an active surface thereof and a passivation layer covering said active surface, said passivation layer having a plurality of openings in locations corresponding to said plurality of bond pads, said at least one microelectronic die being fixed within a package core;
- and
- an interfacial metal layer over said passivation layer, said interfacial metal layer having a plurality of separate conductive elements including at least one conductive element that is conductively coupled to multiple bond pads on said at least one microelectronic die through corresponding openings in said passivation layer.
A microelectronic device comprising:
- a package core;
- a first microelectronic die fixed within said package core, said first microelectronic die having bond pads on an active surface thereof;
- a second microelectronic die fixed within said package core, said second microelectronic die having bond pads on an active surface thereof;
- and
- an interfacial metal layer deposited over said first and second microelectronic dice, said interfacial metal layer having a first conductive element that is conductively coupled to both a first bond pad on said first microelectronic die and a second bond pad on said second microelectronic die.
Dependencies are inferred from the claim text.