Semiconductor device and its manufacturing method
AssigneeTexas Instruments Incorporated
InventorsNorito Umehara, Masazumi Amagai
Life of this patent
Estimating the term…
Abstract
The invention is to improve the heat radiation of an LOC type semiconductor device. The semiconductor device related to the present invention has a preferably metal heat-radiating element 7 that is in thermal contact with the surface opposite the principal surface of the semiconductor chip 3. One region of said heat-radiating element 7 is externally exposed from the package that encloses the semiconductor chip 3. The above-mentioned heat-radiating element 7 is in thermal contact with a metal pattern 12 that is formed on the substrate 10 on which the semiconductor device is mounted. The heat from the semiconductor chip is transferred to the mounting substrate 10 side via the heat-radiating plate 7, and heat dissipation is conducted efficiently.
Claims9
A semiconductor device that is equipped with a semiconductor chip;
- multiple semiconductor leads with one end of each conductive lead positioned on the main surface of the above-mentioned semiconductor chip and electrically connected to said semiconductor chip, and with the other end extend outward for the purpose of connecting to an external section, a heat-radiating element that is in thermal contact with the surface opposite principal the principal surface of the above-mentioned semiconductor chip, and by which the heat of the above-mentioned semiconductor chip escapes to an external section, a packaging element that forms the external shape of the semiconductor device by enclosing the above-mentioned semiconductor chip, and which exposes one section of the above-mentioned heat-radiating element to an external section.
A semiconductor device manufacturing method comprising a process for forming on the surface opposite the principal surface of the semiconductor chip an element for adhering a heat-radiating element by which means the heat of said semiconductor chip can escape to the outside, a process for arranging, on the principal surface of the above-mentioned semiconductor chip, multiple conductive leads that extend outward for the purpose of connecting one end of each lead to an external section and electrically connecting the other end of each of the above-mentioned conductive leads to the above-mentioned semiconductor chip, and a process for sealing the above-mentioned semiconductor chip by means of a package element in a configuration in which one portion of the above-mentioned heat-radiating element is exposed to the outside.
Dependencies are inferred from the claim text.