Semiconductor device
AssigneeKabushiki Kaisha Toyota Jidoshokki
InventorsKazuhiro Maeno, Eiji Kono
Life of this patent
Estimating the term…
Abstract
A board-shaped thermal conductor base board (3) is arranged on the bottom surface of a power module (1). Substrates (4) and (5) are arranged on the top surface of the thermal conductor base board (3), and semiconductor elements (6) and (7) are respectively arranged on the top surfaces of the substrates (4) and (5). The semiconductor elements (6, 7) are surrounded by a resinous case (2). A source electrode (13) is attached above and apart from the semiconductor elements (6, 7) by using the resinous case (2). The connection between the source electrode (13) and the sources of the semiconductor elements (7) are connected by wire bonding.
Claims10
A semiconductor device, comprising:
- a plurality of semiconductor elements arranged on a substrate;
- and
- a main current electrode which is arranged vertically to a surface of the substrate and apart from a neighborhood of said plurality of semiconductor elements, wherein
- each of said plurality of semiconductor elements and said main current electrode are electrically connected.
A semiconductor device including one or a plurality of semiconductor elements, comprising:
- a substrate on which the one or the plurality of semiconductor elements are arranged;
- a case that is arranged in a predetermined position relative to said substrate so that the one or the plurality of semiconductor elements are surrounded;
- and
- a metal member on which a main current electrode of the one or the plurality of semiconductor elements and a terminal for electrically connecting said semiconductor device and a circuit external to said semiconductor device are formed integrally, wherein
- said metal member is arranged in a position apart from said substrate by using said case.
Dependencies are inferred from the claim text.