Semiconductor device and semiconductor device manufacturing method

A semiconductor device comprising:

• a semiconductor substrate that includes a main surface having a circuit element with a specific function formed thereupon;
• a plurality of electrode pads formed at an upper portion of said main surface of said semiconductor substrate and electrically connected with said circuit element;
• sealing resin that seals the upper portion of said main surface of said semiconductor substrate;
• and
• a plurality of external connection terminals formed at the upper portion of said main surface so as to project out of the surface of said sealing resin and arranged in a substantially regular array over specific intervals from one another, wherein:
• at least one of side surfaces of the semiconductor device is colored differently from the other side surfaces.

A semiconductor device comprising:

• a semiconductor substrate that include a first main surface having a circuit element formed thereupon and a second main surface facing substantially opposite said first main surface;
• a plurality of external terminals formed at an upper portion of said first main surface and electrically connected with said circuit element;
• and
• a direction index mark constituted of a line segment having a start point and an end point and an end point mark provided at said end point and formed on said second main surface.

A semiconductor device manufacturing method, comprising;

• a step in which a semiconductor wafer having a first main surface, a second main surface facing substantially opposites said first main surface and a plurality of semiconductor device forming areas defined by a plurality of scribe lines is prepared;
• a step in which circuit elements are formed at said first main surface over said semiconductor device forming areas,
• a step in which a plurality of external terminals to be electrically connected with said circuit elements are formed at an upper portion of said first main surface over said semiconductor device forming areas;
• a step in which information indicating the direction of semiconductor devices is added onto said second main surface;
• and
• a step in which said semiconductor devices are obtained by cutting said semiconductor wafer along said scribe lines and separating said semiconductor device forming areas into individual units.