Laminated body, capacitor, electronic part, and method and device for manufacturing the laminated body, capacitor, and electronic part

A layered product of a plurality of resin thin films and a plurality of metal thin films,

• wherein at least one layer of the resin thin films is provided with a cutout portion in a portion of its periphery;
• wherein the cutout portion electrically connects upper and lower metal thin films;
• and
• wherein the cutout portion can provide an electrical lead to the outside for at least one layer of the metal thin films.

A capacitor comprising a layered product of a plurality of resin thin films and a plurality of metal thin films,

• wherein edges of the metal thin films are not exposed on the outside of the layered product;
• wherein at least one layer of the resin thin films is provided with a via hole in the layering direction;
• wherein the via hole electrically connects the metal thin films such that every other of the metal thin films is on the same potential;
• and
• wherein the via hole can provide an electrical lead to the outside for the metal thin films put on the same potential.

A capacitor comprising a layered product of a plurality of resin thin films and a plurality of metal thin films,

• wherein at least one layer of the resin thin films is provided with a cutout portion in a portion of its periphery;
• wherein the cutout portion electrically connects the metal thin films such that every other of the metal thin films is on the same potential;
• and
• wherein the cutout portion can provide an electrical lead to the outside for the metal thin films put on the same potential.

A method for manufacturing a layered product comprising resin thin films and metal thin films layered in alternation, the method comprising:

• a step of forming the resin thin films and the metal thin films in alternation by forming the metal thin films within a formation region of the resin thin films, such that the formation area of the metal thin films is smaller than the formation area of the resin thin films, and modifying the formation position of the metal thin films for each metal thin film layer;
• a step of forming a via hole penetrating the resin thin films and the metal thin films;
• and
• a step of filling conductive material into the via hole to electrically connect at least some of the metal thin films with the conductive material.

A method for manufacturing a capacitor, comprising:

• a step of forming resin thin films and metal thin films in alternation by forming the metal thin films within a formation region of the resin thin films, such that the formation area of the metal thin films is smaller than the formation area of the resin thin films, and modifying the formation position of the metal thin films for each metal thin film layer;
• a step of forming a via hole penetrating the resin thin films and the metal thin films;
• and
• a step of filling conductive material into the via hole to electrically connect every other of the metal thin films.

An apparatus for manufacturing a layered product, comprising:

• a rotating carrier;
• a metal thin film formation device and a resin thin film formation device arranged in opposition to the carrier;
• a vacuum container accommodating the rotating carrier, the metal thin film formation device and the resin thin film formation device;
• and
• a laser patterning device for machining metal thin films, arranged downstream from the metal thin film formation device and upstream from the resin thin film formation device.

An apparatus for manufacturing a layered product, comprising:

• a rotating carrier;
• a metal thin film formation device and a resin thin film formation device arranged in opposition to the carrier;
• a vacuum container accommodating the rotating carrier, the metal thin film formation device and the resin thin film formation device;
• a laser machining device for forming holes in a layering direction;
• and
• an oil application device for applying oil on a resin thin film, arranged downstream from the resin thin film formation device and upstream from the metal thin film formation device.

An apparatus for manufacturing a layered product, comprising:

• a rotating carrier;
• a metal thin film formation device and a resin thin film formation device arranged in opposition to the carrier;
• a vacuum container accommodating the rotating carrier, the metal thin film formation device and the resin thin film formation device;
• and
• an oil application device for applying oil on a resin thin film, arranged downstream from the resin thin film formation device and upstream from the metal thin film formation device;
• wherein the oil application device comprises at least one pair of nozzles having a certain arrangement of micro-holes.

An apparatus for manufacturing a layered product, comprising:

• a rotating carrier;
• a metal thin film formation device and a resin thin film formation device arranged in opposition to the carrier;
• a vacuum container accommodating the rotating carrier, the metal thin film formation device and the resin thin film formation device;
• a laser machining device for forming holes in a layering direction;
• an oil application device for applying oil on a resin thin film, arranged downstream from the resin thin film formation device and upstream from the metal thin film formation device;
• and
• a laser patterning device for machining metal thin films, arranged downstream from the metal thin film formation device and upstream from the resin thin film formation device.

An electronic component comprising:

• a layered product including at least two layers each of resin thin films and metal thin films;
• and
• an electrode formed on a portion of a lateral surface of the layered product, the normal on the layered surface being oriented in a direction that is different from the layering direction, and electrically connected to the metal thin films;
• wherein the metal thin films are not exposed at lateral surfaces where the layered product is not provided with electrodes.