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AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsTsutomu Mitani, Hiroaki Takezawa, Yukihiro Ishimaru, Takashi Kitae, Yasuhiro Suzuki
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A conductive adhesive comprises main components of a conductive filler and a binder resin, and a content of the conductive filler is in a range from 20 wt % to 70 wt %. It is preferable that at least a part of the conductive filler has protrusions. A dendrite metal filler is especially preferred. When this adhesive is compressed, the resin component is squeezed out, while the conductive filler component remains inside. As a result, the concentration of the conductive filler component is raised inside, and this is useful in connecting the electrodes by scratching the surfaces of the electrodes. No solder is required in forming a conductive adhesive 3 on a substrate electrode 2 of a circuit substrate 1 and also for packaging an electronic element 4. Provided also are a package of an electronic element using the conductive adhesive with improved initial and long-term reliability, and a method of packaging the same.
A conductive adhesive comprising a conductive filler and a binder resin as main components, wherein a content of the conductive filler is in a range from 20 wt % to 70 wt %.
A package of an electronic element provided by electrically connecting a circuit substrate electrode to an electronic element electrode by means of a conductive adhesive containing a conductive filler and a binder resin, wherein
A packaging method comprising connecting electrically a circuit substrate electrode to an electronic element electrode by means of a conductive adhesive comprising a conductive filler and a binder resin, wherein
Dependencies are inferred from the claim text.