Formation of an optical component
OwnerChi Wu, Yiqiong Wang +1inventors
InventorsChi Wu, Yiqiong Wang, Xiaoming Yin
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Abstract
A method of forming an optical component is disclosed. The method includes obtaining a wafer having a light transmitting medium positioned over a base. The method also includes applying an etching medium to the wafer so as to form one or more surfaces of an optical component in the light transmitting medium. The etching medium is applied in an etching chamber configured to etch a wafer having at least one dimension with a length greater than 6 inches.
Claims72
A method of forming an optical component, comprising:
- obtaining a wafer having a light transmitting medium positioned over a base;
- and
- applying an etching medium to the wafer so as to form one or more surfaces of an optical component in the light transmitting medium, the etching medium being applied in an etching chamber configured to etch wafers having at least one dimension with a length greater than 6 inches.
A method of forming an optical component, comprising:
- obtaining a wafer having a light transmitting medium positioned over a base, the wafer having one or more dimensions with a length greater than 6 inches;
- and
- applying an etching medium to the wafer so as to form one or more surfaces in the light transmitting medium, the one or more surfaces including a surface of an optical component.
A method of forming an optical component, comprising:
- obtaining a wafer having a light transmitting medium positioned over a base;
- and
- applying an etching medium to the light transmitting so as to form one or more surfaces of an optical component to a height greater than 2 μm, application of the etching medium excluding applying the etching medium in one or more repeated cycles during formation of the one or more surfaces.
A method of forming an optical component, comprising:
- obtaining a wafer having a light transmitting medium positioned over a base;
- and
- applying an etching medium to the light transmitting so as to form one or more surfaces of an optical component to a height greater than 2 μm, the etching medium being continuously applied during formation of the one or more surfaces.
Dependencies are inferred from the claim text.