Apparatus and method for contacting a conductive layer
AssigneeSTMicroelectronics S.r.l.
InventorsArnaud Yves Lepert, Danielle A. Thomas, Antonio A. Do-Bento-Vieira
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AssigneeSTMicroelectronics S.r.l.
InventorsArnaud Yves Lepert, Danielle A. Thomas, Antonio A. Do-Bento-Vieira
Estimating the term…
A structure and method for creating a contact between a conductive layer and a pad for dissipating electrostatic charges comprising the steps of, forming a pad and a composite insulating layer between and over conductive plates on a substrate, wherein the insulating layer isolates and protects the conductive plates and pad from damage, the insulating layer comprising a dielectric region underlying a conductive layer. A passivation layer is formed over at least a portion of the conductive layer and a photoresist is patterned over at least a portion of the passivation. An opening is etched through the passivation and the insulating layers, wherein the photoresist and the conductive layer serve as masks. Finally, a conductive material is deposited in the opening to form an electrical contact between the pad and the conductive layer.
A method of forming an electrostatic discharge device contact comprising the steps of:
The method of claim 4, wherein the conductive material comprises a wire bond.
A method of forming an electrostatic discharge device contact comprising the steps of:
An integrated circuit sensor mask for making a contact between layers in an integrated circuit comprising:
Dependencies are inferred from the claim text.