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US 2002/0158040 A1Published application
Method for fabricating a microelectromechanical system (MEMS) device using a pre-patterned substrate
AssigneeRockwell Automation Technologies, Inc.
InventorsMark A. Lucak, Richard D. Harris, Michael J. Knieser, Robert J. Kretschmann
Life of this patent
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Abstract
A method for fabricating MEMS structure includes etching a recess in an upper surface of a substrate that is bonded to a wafer that ultimately forms the MEMS structure. Accordingly, once the etching processes of the wafer are completed, the recess facilitates the release of an internal movable structure within the fabricated MEMS structure without the use of a separate sacrificial material.
Claims39
A method of fabricating a MEMS structure, comprising the steps of:
- (a) forming a recess in an upper surface of a substrate;
- (b) attaching an etchable wafer to the upper surface of the substrate, including a wafer portion from which a movable structure will be formed, the wafer portion being positioned over the recessed;
- and
- (c) etching downward in the wafer around the periphery of the movable portion to break through in to the recess, thereby releasing at least part of the movable structure from the substrate without the need for substantial undercutting.
1 more element
A MEMS structure comprising:
- a substrate having a recess disposed in the upper surface thereof;
- at least one conductive element that is attached to the substrate and that extends outwardly therefrom;
- a movable MEMS element disposed adjacent the at least one conductive element forming a variable size gap therebetween, wherein the movable MEMS element is free from the substrate and in at least partial alignment with the recess.
A MEMS structure comprising:
- a substrate having a recess disposed in the upper surface thereof;
- at least one conductive element that is directly attached to the substrate and that extends outwardly therefrom;
- a movable MEMS element disposed adjacent the at least one conductive element forming a variable size gap therebetween, wherein the movable MEMS element is free from the substrate and in at least partial alignment with the recess.
A MEMS structure comprising:
- a substrate having a recess disposed in the upper surface thereof;
- first and second conductive elements that are directly attached to the substrate and that extend outwardly therefrom;
- a movable MEMS element disposed adjacent the conductive elements forming a variable size gaps therebetween, wherein the movable MEMS element is free from the substrate and in at least partial alignment with the recess.
Dependencies are inferred from the claim text.