Dicing method and apparatus for cutting panels or wafers into rectangular shaped die
AssigneeKulicke & Soffa Investments, Inc.
InventorEli Toledano
Life of this patent
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AssigneeKulicke & Soffa Investments, Inc.
InventorEli Toledano
Estimating the term…
A method and apparatus for cutting panels or wafers into rectangular shaped die. The apparatus includes a spindle; and a first blade having a first diameter and a second blade having a second diameter smaller that the first diameter each blade mounted to the spindle and spaced apart from one another. The first blade and second blades cut the workpiece based on a direction of movement of said workpiece relative to the first and second blades. The method includes the steps of mounting a first blade having a first diameter and a second blade having a second diameter smaller that the first diameter on a spindle; moving the workpiece relative to the first and second blades; cutting the workpiece along a first direction with the first blade; and cutting the workpiece along a second direction with both the first and second blades simultaneously.
A device for producing a plurality of rectangular shaped die from a workpiece, the device comprising:
A device for producing a plurality of rectangular shaped die from a workpiece, the device comprising:
The device according to claim 14, wherein workpiece is a one of a semiconductor substrate, a BGA panel, and a microelectronic device.
A device for producing a plurality of rectangular shaped die from a workpiece, the device comprising:
A method for producing a plurality of rectangular shaped die from a workpiece, the method comprising the steps of:
A method for producing a plurality of rectangular shaped die from a workpiece, the method comprising the steps of:
A method for producing a plurality of rectangular shaped die from a workpiece, the method comprising the steps of:
A device for producing a plurality of rectangular shaped die from a BGA panel, the device comprising:
Dependencies are inferred from the claim text.