Method, apparatus, system, method and device for data creating, and program for mounting electronic component

An electronic component mounting apparatus for mounting an electronic component comprising;

• a mounting means for mounting the electronic component on the circuit board on which is formed a land and printed a solder paste by referring to a printing position of the solder paste as a reference.

An electronic component mounting system for mounting an electronic component comprising:

• a printing position detecting device for detecting a printing position of a solder paste on a circuit board on which a land is formed and the solder paste is printed, and
• an electronic component mounting apparatus for mounting an electronic component on the circuit board by referring the detected printing position of said solder paste.

An electronic component mounting data creating method comprising the step of:

• creating the mounting data by an electronic component mounting apparatus including a mounting means for mounting the electronic component on the circuit board on which is formed a land and printed a solder paste by referring to a printing position of the solder paste as a references.

An electronic component mounting data creating method comprising the step of:

• creating the mounting data by an external device connected to a electronic component mounting apparatus including a mounting means for mounting the electronic component on the circuit board on which is formed a land and printed a solder paste by referring to a printing position of the solder paste as a reference, and
• fetching said mounting data into the electronic component mounting apparatus.

An electronic component mounting data creating method comprising the step of:

• setting a correction amount integrally according to types of the electronic component and solder paste by using a table, and
• wherein the correction amount is utilized for changing a target position for mounting an electronic component from a land position toward a solder paste printing position;
• wherein the table is previously registered a degree of a self-alignment effect according to each type of combination of the electronic component and the solder paste.

A mounting data creating device for creating mounting data for mounting an electronic component on a circuit board on which a land is formed and a solder paste is printed,

• wherein said mounting data creating device is provided separately from an electronic component mounting apparatus, and
• wherein the mounting data are obtained by detecting a printing position of the solder paste on the circuit board so that said electronic component mounting apparatus mounts the electronic component on the circuit board with referring to the printing position of the solder paste as a reference.

A program for mounting an electronic component on a circuit board comprising:

• a mounting data recorded in the program and supplied to an electronic component mounting apparatus including a mounting means for mounting the electronic component on the circuit board on which a land is formed and a solder paste is printed by referring to a printing position of the solder paste as a reference.