Solderability testing apparatus and solderability testing method
AssigneeSony Corporation
InventorsTamiharu Masatoki, Yutaka Shinozaki
Life of this patent
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Abstract
This invention discloses a solderability testing apparatus which comprises a sample parts holding means having a sample parts holding member for holding a sample; an external force detection means for supporting such sample parts holding means; a solder paste container for containing a solder paste which is internally added with a flux; and a heating means for heating the solder paste; wherein such apparatus has a flux wetting preventive layer at least on the surface of a sample holding portion of the sample parts holding member.
Claims16
A solderability testing apparatus comprising:
- a sample parts holding means having a sample parts holding member for holding a sample;
- an external force detection means for supporting said sample parts holding means;
- a solder paste container for containing a solder paste which is internally added with a flux;
- and
- a heating means for heating the solder paste;
- wherein said apparatus has a flux wetting preventive layer at least on the surface of a sample holding portion of the sample parts holding member.
A solderability testing apparatus comprising:
- a sample parts holding means having a sample parts holding member for holding a sample;
- an external force detection means for supporting said sample parts holding means;
- a solder paste container for containing a solder paste which is internally added with a flux;
- and
- a heating means for heating the solder paste;
- wherein at least a sample holding portion of the sample parts holding member is made of a material having a poor wetting balance in respect of the flux.
A solderability testing method using a solderability testing apparatus, said apparatus comprising:
- a sample parts holding means having a sample parts holding member for holding a sample;
- an external force detection means for supporting said sample parts holding means;
- a solder paste container for containing a solder paste which is internally added with a flux;
- and
- a heating means for heating the solder paste;
- said apparatus having a flux wetting preventive layer at least on the surface of a sample holding portion of the sample parts holding member;
- wherein said method comprises a step of heating and melting the solder paste using a heating means while keeping a part of a sample, which is held by a sample parts holding member, being dipped therein, and measuring time-dependent changes in the acting force effected between the molten solder paste and the sample using the external force detection means.
A solderability testing method using a solderability testing apparatus, which apparatus comprising:
- a sample parts holding means having a sample parts holding member for holding a sample;
- an external force detection means for supporting said sample parts holding means;
- a solder paste container for containing a solder paste which is internally added with a flux;
- and
- a heating means for heating the solder paste;
- said apparatus having a flux wetting preventive layer at least on the surface of a sample holding portion of the sample parts holding member;
- said sample parts holding member having a sample holding portion which is made of a material having a poor wetting balance in respect of the flux,
- wherein said method comprises a step of heating and melting the solder paste using a heating means while keeping a part of a sample, which is held by a sample parts holding member, being dipped therein, and measuring time-dependent changes in the acting force effected between the molten solder paste and the sample using the external force detection means.
Dependencies are inferred from the claim text.