Method of manufacturing card-type storage device and card-type storage device
AssigneeKabushiki Kaisha Toshiba
InventorsHiroshi Iwasaki, Osami Suzuki
Life of this patent
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Abstract
A method of manufacturing a small, thin card-type storage device is capable of easily manufacturing a frame for the storage device from a variety of resin materials without molding a very thin recessed bottom of the supporter. The method prepares a card-type support frame member from resin and a sheet material, cuts the sheet material into the size of the support frame member, to form a support sheet, bonds the support sheet to a bottom surface of the support frame member, to form a frame, and fits a memory module to be fixed in an opening of the support frame member in the frame, thereby completing the card-type storage device.
Claims55
A method of manufacturing a card-type storage device, comprising the steps of:
- (a) preparing a card-type support frame member having an opening;
- (a′) preparing a sheet material;
- (b) cutting the sheet material into the size of the support frame member, to form a support sheet;
- (c) bonding the support sheet to a bottom surface of the support frame member, to form a frame;
- and
- (d) fitting a memory module to be fixed in the opening of the support frame member in the frame, the memory module having at least one semiconductor memory sealed therein on a first surface of the memory module and a flat external terminal exposed on a second surface of the memory module.
A method of manufacturing a card-type storage device, comprising the steps of:
- (aa) preparing a card-type support frame member having an opening;
- (aa′) preparing a sheet material;
- (bb) bonding a bottom surface of the support frame member onto the sheet material;
- (cc) cutting the sheet material along the support frame member, to form a frame made of the support frame member and the cut sheet material serving as a support sheet attached to the bottom surface of the support frame member;
- and
- (dd) fitting a memory module to be fixed in the opening of the support frame member in the frame, the memory module having at least one semiconductor memory sealed therein on a first surface of the memory module and a flat external terminal exposed on a second surface of the memory module.
A method of manufacturing card-type storage devices, comprising the steps of:
- (aaa) preparing, from resin, a frame member set made of consecutively joined card-type support frame members each having an opening;
- (aaa′) preparing a sheet material whose size is substantially equal to or larger than the frame member set;
- (bbb) bonding a bottom surface of the frame member set onto the sheet material;
- (ccc) cutting the frame member set along the support frame members to simultaneously form frames each made of the support frame member and the cut sheet material serving as a support sheet attached to the bottom surface of the support frame member;
- and
- (ddd) fitting a memory module to be fixed in the opening of the support frame member of each of the frames, the memory module having at least one semiconductor memory sealed therein on a first surface of the memory module and a flat external terminal exposed on a second surface of the memory module.
A method of manufacturing a card-type storage device, including a card-type support frame member made of resin and having an opening, a support sheet bonded to a bottom surface of the support frame member, and a memory module having at least one semiconductor memory sealed with resin on a first surface of the memory module and a flat external terminal exposed on a second surface of the memory module, comprising the steps of:
- (a) preparing the support frame member and a sheet material;
- (b) cutting the sheet material into the size of the support frame member, to form the support sheet;
- (c) bonding the support sheet to the bottom surface of the support frame member, to form a frame;
- and
- (d) fitting the memory module to be fixed in the opening of the support frame member in the frame.
A card-type storage device, comprising:
- a card-type support frame member having an opening and made of transparent or translucent material;
- a support sheet bonded to a bottom surface of the support frame member;
- and
- a memory module having at least one semiconductor memory sealed therein on a first surface of the memory module and a flat external terminal exposed on a second surface of the memory module, the card-type storage device being manufactured through the steps of:
- (a″) preparing the support frame member and a sheet material;
- (b″) cutting the sheet material into the size of the support frame member, to form the support sheet;
- (c″) bonding the support sheet to the bottom surface of the support frame member, to form a frame;
- and
- (d″) fitting the memory module to be fixed in the opening of the support frame member in the frame.
A card-type storage device, comprising:
- (a) a frame including, a card-type support frame member having an opening and made of resin, and a support sheet bonded to a bottom surface of the support frame member;
- and
- (b) a memory module including at least one semiconductor memory sealed therin on a first surface of the memory module and a flat external terminal exposed on a second surface of the memory module, the memory module being fitted in the opening of the support frame member in the frame such that the second surface thereof aligns with a top surface of the frame.
A card-type storage device, comprising:
- a card-type support frame member including a first area and a second area, the first area having an opening and at least a portion of the second area being made from transparent or translucent material;
- and
- a memory module fitted in the opening, the memory module including at least non-volatile semiconductor memory, wherein said semiconductor memory contains certain information, and the second area has a picture or characters concerning said information.
Dependencies are inferred from the claim text.