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US 2002/0154492 A1Published application
Assembling structure of electronic device
OwnerKai Hung Huang, Yi Hwa Hsieh +1inventors
InventorsKai Hung Huang, Yi Hwa Hsieh, Kun-Feng Chen
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Abstract
An assembling structure of electronic devices for an electronic product is provided. The assembling structure includes a first circuit board, a second circuit board having higher thermal conductivity than the first circuit board and at least one high-power electronic device mounted thereon, and a connecting element for electrically coupling the first circuit board with the second circuit board.
Claims18
An assembling structure of electronic devices for an electronic product, comprising:
- a first circuit board;
- a second circuit board having higher thermal conductivity than said first circuit board and at least one high-power electronic device mounted thereon;
- and
- a connecting element for electrically coupling said first circuit board with said second circuit board.
1 more element
An assembling structure of electronic devices for an electronic product, comprising:
- a first circuit board selected from a group consisting of a copper clad laminate (CCL) substrate circuit board, a glass fiber reinforced epoxy substrate board and a thermoplastic substrate board;
- a second circuit board selected from one of a clad metal substrate board and a ceramic substrate board and having at least one high-power electronic device mounted thereon;
- and
- a connecting element for electrically coupling said first circuit board with said second circuit board.
1 more element
Dependencies are inferred from the claim text.