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AssigneeFuji Machine Mfg. Co., Ltd.
InventorShinsuke Suhara
Estimating the term…
A printed-wiring-board holding device includes a printed-wiring-board supporting device and a printed-wiring-board pressing device. The printed-wiring-board pressing device includes a pressing-plate elevating device and guide device. The pressing plate has openings formed through its portions corresponding to portions of a printed-wiring board onto which electronic components are to be mounted. When the electronic components are mounted onto the printed-wiring board, support pins of the printed-wiring-board supporting device are brought into contact with a bottom surface of the printed-wiring board, while the pressing plate is brought into contact with a top surface of the printed-wiring board, for thereby restraining the printed-wiring board from opposite sides of the printed-wiring board. Thus, the printed-wiring board is held while being held flattened without being warped. The pressing member may be provided by a frame member so that the pressing frame member can be brought into contact, at its protrusion portions protruding toward the printed-wiring board, with spot portions of the printed-wiring board.
A printed-board holding device used for a work system in which a printed board and a working head are moved relative to each other in a direction parallel with a top surface of the printed board so that the working head applies high viscous fluid, mounts electric components or executes other operation in each of a plurality of predetermined portions of the top surface of the printed board, said printed-board holding device comprising:
An electric-component mounting system, comprising:
A method of manufacturing a printed circuit board, by making a suction nozzle suck an electric component and mount the electric component onto each of a plurality of predetermined portions of a top surface of a printed board,
Dependencies are inferred from the claim text.