Method of forming a capacitor
AssigneeMicron Technology, Inc.
InventorEugene P. Marsh
Life of this patent
Estimating the term…
Abstract
A conductive structure, including an adhesion layer and a conductor in contact with the adhesion layer and having a thickness of less than six hundred Angstroms. The present invention may be used to form a capacitor, including an adhesion layer, a first conductor in contact with the adhesion layer and having a thickness of less than six hundred Angstroms, a second conductor, and a dielectric between the first and second conductors. The present invention is also directed towards structures wherein iridium or rhodium may be used in place of the combination of the adhesion layer and conductor.
Claims50
A conductive structure, comprising:
- an adhesion layer;
- and
- a conductor in contact with said adhesion layer and having a thickness of less than six hundred Angstroms.
A conductive structure, comprising:
- an adhesion layer;
- and
- a layer of platinum in contact with said adhesion layer and having a thickness of less than six hundred Angstroms.
A capacitor, comprising:
- an adhesion layer;
- a first conductor in contact with said adhesion layer and having a thickness of less than six hundred Angstroms;
- a second conductor;
- and
- a dielectric between said first and second conductors.
A capacitor, comprising:
- a post;
- an adhesion layer in contact with said post;
- a first conductor in contact with said adhesion layer and having a thickness of less than six hundred Angstroms;
- a second conductor;
- and
- a dielectric between said first conductor and said second conductor.
A capacitor, comprising:
- a substrate;
- an adhesion layer defining an opening and in contact with said substrate;
- a first conductor in contact with said adhesion layer and having a thickness of less than six hundred Angstroms;
- a second conductor;
- and
- a dielectric between said first conductor and said second conductor.
A conductive structure, comprising:
- a substrate;
- and
- a layer of noble metal selected from the group consisting of iridium and rhodium, said layer having a thickness of less than six hundred Angstroms and in contact with said substrate.
A capacitor, comprising:
- a substrate;
- a layer of noble metal selected from the group consisting of iridium and rhodium, said layer having a thickness of less than six hundred Angstroms and in contact with said substrate;
- a conductor;
- and
- a dielectric between said layer of noble metal and said conductor.
A capacitor, comprising:
- a substrate forming a post;
- a layer of noble metal selected from the group consisting of iridium and rhodium, said layer having a thickness of less than six hundred Angstroms and in contact with said post;
- a conductor;
- and
- a dielectric between said layer of noble metal and said conductor.
A capacitor, comprising:
- a substrate;
- a layer of noble metal selected from the group consisting of iridium and rhodium, said layer defining an opening, having a thickness of less than six hundred Angstroms, and in contact with said substrate;
- a conductor;
- and
- a dielectric between said layer of noble metal and said conductor.
A conductive structure, comprising;
- means for conducting electromagnetic energy having a thickness of less than six hundred Angstroms;
- and
- means for adhering said means for conducting to a substrate.
A capacitor, comprising:
- first means for conducting electromagnetic energy having a thickness of less than six hundred Angstroms;
- means for adhering said first means for conducting to a substrate;
- second means for conducting electromagnetic energy;
- and
- means for insulating said first means for conducting electromagnetic energy from said second means for conducting electromagnetic energy.
A system, comprising:
- a bus;
- a first device connected to said bus, said first device including a conductive structure, said conductive structure having an adhesion layer and a conductor in contact with said adhesion layer, said conductor having a thickness of less than six hundred Angstroms;
- and
- a second device connected to said bus.
Dependencies are inferred from the claim text.