Infrared data communication module and method of making the same
AssigneeRohm Co., Ltd.
InventorTomoharu Horio
Life of this patent
Estimating the term…
Abstract
An infrared data communication module includes a substrate having a surface on which a light emitting element, a light receiving element, and an IC element are mounted. A resin package is formed on the substrate for integrally enclosing the light emitting element, the light receiving element and the IC element. A shield member is formed within the resin package for covering the IC element to prevent light-attributable noises from reaching the IC element.
Claims12
An infrared data communication module comprising:
- a substrate having a surface on which a light emitting element, a light receiving element, and an IC element are mounted;
- a resin package formed on the substrate for integrally enclosing the light emitting element, the light receiving element and the IC element;
- and
- a shield member formed within the resin package for covering the IC element to protect the IC element against light-attributable noises.
A method of making an infrared data communication module comprising a substrate having a surface on which a light emitting element, a light receiving element, and an IC element are mounted;
- a resin package formed on the substrate for integrally enclosing the light emitting element, the light receiving element and the IC element;
- and a shield member formed within the resin package for covering the IC element to protect the IC element from light-attributable noises;
- the method comprising the steps of:
- preparing a light-shielding resin by mixing a thermosetting resin with an oxide for blocking infrared light and a dye for blocking visible light;
- applying the light-shielding resin to cover the IC element;
- and
- heating the applied light-shielding resin for hardening.
Dependencies are inferred from the claim text.