Ink jet recording head and fabrication method thereof
AssigneeFuji Xerox Co., Ltd.
InventorsTorahiko Kanda, Kenichi Ohno, Toru Nishida
Life of this patent
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Abstract
In an ink jet recording head having a crystalline substrate in which at least one nozzle and at least one ink chamber formed in the crystalline substrate, a gap is provided in a connecting portion between the nozzle and the ink chamber below an opening portion of the nozzle such that a variation of the ink jetting function due to an axial deviation between the nozzle and the ink chamber is restricted by absorbing the axial deviation by the gap. The gap is formed such that extension lines of wall surfaces of the ink chamber formed by etching are positioned inside the gap.
Claims7
An ink jet recording head comprising:
- at least one nozzle for jetting ink;
- at least one ink chamber connected to said ink nozzle and filled with ink, which is pressurized;
- and an ink supply path for supplying ink to said ink chamber,
- wherein at least said nozzle and said ink chamber are formed in one and the same crystalline substrate;
- and
- a gap portion having a diameter larger than a diameter of a connecting portion of said nozzle and said ink chamber on the side of said ink chamber is formed.
A method for fabricating an ink jet recording head, comprising the steps of:
- forming a high density impurity diffusion layer in one surface of a silicon substrate;
- opening a nozzle by dry etching said high density impurity diffusion layer;
- forming an opening portion for etching in a position in the other surface of said silicon substrate, in which an ink chamber is to be formed;
- and
- forming said ink chamber by anisotropic etching from the both surfaces of said silicon substrate.
A method for fabricating an ink jet recording head, comprising the steps of:
- forming a high density impurity diffusion layer in one surface of a silicon substrate;
- opening a nozzle by dry etching said high density impurity diffusion layer;
- forming an opening portion for etching in a position in the other surface of said silicon substrate, in which an ink chamber is to be formed;
- and
- forming said ink chamber by anisotropic etching from one of the surfaces of said silicon substrate and then by anisotropic etching from the other surface of said silicon substrate.
Dependencies are inferred from the claim text.