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US 2002/0153977 A1Published application
Apparatus and method for angled coaxial to planar structure broadband transition
AssigneeVitesse Semiconductor Corporation
InventorsRobert J. McDonough, Weimin Sun
Life of this patent
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Abstract
A semiconductor device package adapted for use with high frequency signals and/or coaxial connections. The package has an angled coaxial input shielded by a plurality of vias. In one embodiment the coaxial input is orthogonal to a leadframe, and the coaxial input is matched to a transmission line on the leadframe.
Claims35
A packaging device comprising:
- a leadframe including an aperture adapted to pass a signal on a coaxial transmission medium through the leadframe, the leadframe containing a plurality of vias about the aperture, whereby the vias provide electromagnetic shielding of signals passed through the aperture;
- a die operatively disposed on the leadframe and adapted to receive a semiconductor device;
- and
- a signal path between a location approximate the aperture and a location approximate the die.
1 more element
A packaging device comprising:
- a substrate;
- a die adopted to receive a semiconductor device operatively disposed on the substrate;
- an input port connecting to the substrate at an angle to a plane formed by a surface of the substrate;
- a signal path on the substrate running from the area approximate the input port to approximate the die;
- and
- a coaxial transmission medium, adapted to pass a signal, located in the input port and substantially nonplanar to the signal path.
3 more elements
A package for a semiconductor device, the semiconductor device operating on high frequency signals, the semiconductor device being located on a die, comprising:
- a substrate adapted for placement of the die at a die location thereon;
- means for passing a signal on a coaxial medium to a location on the substrate, the means for passing including a passage with an axis defining an obtuse angle with respect to a plane formed by the substrate;
- and
- means for shielding electrical signals about the location on the substrate.
1 more element
Dependencies are inferred from the claim text.