Testing head having vertical probes for semiconductor integrated electronic devices

A testing head having vertical probes and comprising:

• a plurality of plate-like holders provided with respective guide holes;
• and
• a plurality of contact probes held within the guide holes of the plate-like holders and formed with respective contact tips arranged to mechanically and electrically contact a plurality of contact pads of at least an integrated electronic device to be tested,
• the contact probes being deformed in a deflection region defined between the plate-like holders as the contact tips abuts onto the contact pads, wherein the contact probes further comprise rigid arms extending laterally from the bodies of the contact probes and terminating in the contact tips, in such a way to offset the contact point of the contact probes with the corresponding contact pads with respect to the longitudinal axis of the contact probes.

A method for creating an electro/mechanical connection between a testing head and a test device, the method comprising:

• holding a plurality of contact probes in the testing head in a vertical manner by a plurality of plate-like holders provided with guide holes, the contact probes having contact tips to contact a plurality of contact pads on a test device;
• establishing a plurality of contact points of the contact probes with the corresponding contact pads, the contact points being offset with respect to a longitudinal axis of the contact probes;
• providing pre-deformed sections of the contact probes in a flexion region between the plate-like holders;
• causing the contacting tips of the contact probes to abut against the contact pads as the test device is pressed against the contacting tips;
• and
• causing the contact probes to deform in correspondence of the pre-deformed sections, as the device to be tested is further pressed against the contacting tip.