Land grid array semiconductor device and method of mounting land grid array semiconductor devices
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsMakio Okada, Yasushi Kasatani, Tomoaki Hashimoto
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Abstract
A main object of the present invention is to provide a land grid array type semiconductor device which has been improved to provide greater positioning accuracy for an external electrode with respect to a mounting substrate. An external electrode is arranged in one surface of a substrate in area array. The external electrode includes an external electrode pad and an external electrode interconnection. The external electrode pad includes a first pad layer formed in a cylinder shape and a second pad layer formed to cover the surface of the first pad layer in a cone shape.
Claims8
A land grid array type semiconductor device, comprising:
- a substrate;
- and
- an external electrode arranged in area array on one surface of said substrate, said external electrode including an external electrode pad and an external electrode interconnection extending from an inside to an outside of said substrate via a through hole, and said external electrode pad being provided to cover a first pad layer formed in a cylinder or rectangular column shape and including a second pad layer formed in a cone or pyramid shape.
A method of mounting a land grid array type semiconductor device, comprising the steps of:
- preparing a land grid array type semiconductor device including a substrate and an external electrode arranged on one surface of said substrate in area array, said external electrode including an external electrode pad and an external electrode interconnection extending from an inside to an outside of said substrate via a through hole, said external electrode pad including a first pad layer formed in a cylinder or rectangular column shape and a second pad layer formed in a cone or pyramid shape to cover a surface of said first pad layer;
- preparing a mounting substrate having a substrate external electrode and a bonding medium provided to cover a surface of said substrate external electrode;
- inserting said second pad layer of said land grid array type semiconductor device into said bonding medium of said mounting substrate to bond said land grid array type semiconductor device to said mounting substrate;
- and
- annealing said mounting substrate mounted with said land grid array type semiconductor device at a temperature of at least a melting point of said bonding medium.
Dependencies are inferred from the claim text.