Integrated circuit packages assembled utilizing fluidic self-assembly

A method for assembling functional component packages comprising:

• placing a functional component in a receptor region wherein said functional component is deposited such that said wired side is facing outward from said receptor region;
• forming a conductive layer on a first dielectric layer of said functional component, said conductive layer forming conductive interconnects to said wired side of said functional components;
• forming a second dielectric layer on said conductive layer, said second dielectric layer having openings for receiving conductive elements;
• depositing conductive elements into said openings, said conductive elements being in contact with said conductive layer;
• and
• attaching said conductive elements in said openings.

An integrated circuit package comprising:

• a substrate, said substrate having a top first dielectric layer, said substrate having at least one recessed receptor region for receiving an integrated circuit;
• at least one integrated circuit deposited in said receptor region, said integrated circuit having a wired side, said integrated circuit being deposited into said receptor region by fluidic self-assembly such that said wired side is facing outward from said receptor region;
• a conductive layer on said first dielectric layer, said conductive layer forming conductive interconnects to said integrated circuit;
• a second dielectric layer on said conductive layer, said second dielectric layer having openings for receiving conductive elements;
• conductive elements, said conductive elements being deposited in said openings so that said conductive elements are in contact with said conductive layer, said conductive elements being attached in said openings.

An integrated circuit package comprising:

• a semiconductor substrate;
• an integrated circuit formed on an upper surface of the semiconductor substrate to form an integrated circuit die having an upper surface and sides extending from a periphery of the upper surface, opposing ones of the sides extending downward and towards one another so that the sides are located below the upper surface;
• a plurality of pads formed on the upper surface of the die and being electrically connected to the integrated circuit;
• and
• a package substrate having upper and lower surfaces, an opening being formed in the upper surface, the opening having sides, opposing ones of the sides extending downward from a periphery of the opening, the substrate having a thickness below the opening and a portion of the thickness being metal, the die being located in the opening with the opposing sides thereof adjacent the opposing sides of the opening and the die being sufficiently close and thermally connected to the metal for heat to transfer from the die to the metal and from the metal away from the substrate.