Die support structure

A semiconductor assembly comprising:

• a die support structure wherein said support structure has a cavity, said cavity being defined by an upper die support surface which has an opening therein and a lower die support surface wherein said cavity extends from the opening to said lower die support surface;
• at least one semiconductor die secured to said lower die support surface;
• at least one electrical connection between said at least one semiconductor die and said support structure;
• and
• at least a portion of said semiconductor assembly encapsulated with encapsulation material.

A semiconductor assembly comprising:

• a semiconductor support structure wherein said structure has a cavity, said cavity being defined by an upper die support surface which has an opening therein and a lower die support surface said cavity extending from said opening to said lower die support surface;
• at least one semiconductor die secured to said lower die support surface;
• and
• at least one semiconductor die secured to said upper die support surface.

A semiconductor assembly comprising:

• a die support structure wherein said structure has a cavity, said cavity being defined by an upper die support surface which has an opening therein and a lower die support surface said cavity extending from said opening to said lower die support surface;
• at least one semiconductor die secured to said bottom surface said die electrically coupled to said structure;
• at least one semiconductor die secured to said structure top surface said die electrically coupled to said structure;
• and
• at least a portion of said semiconductor assembly is encapsulated with encapsulation material.

A semiconductor assembly comprising:

• a die support structure wherein said structure has a cavity, said cavity being defined by an upper die support surface which has an opening therein and a die support bottom surface said cavity extending from said opening to said lower die support surface;
• at least one board-on-chip secured to said upper die support surface said board-on-chip electrically coupled to said support structure;
• and
• at least one flip chip secured to said upper die support surface said flip chip electrically coupled to said support structure.

A method of forming a semiconductor assembly comprising the steps of:

• providing a die support structure having a top and bottom surface;
• providing a cavity in said support structure, said cavity being defined by an upper die support surface which has an opening therein, sidewalls, and a lower die support surface connected with said sidewalls, said cavity extending from said opening to said lower die support surface;
• and
• securing at least one semiconductor die to said lower die support surface.

A method of forming a semiconductor assembly comprising the steps of:

• providing a die support structure having a top and bottom surface;
• providing a cavity in said support structure, said cavity being defined by an upper die support surface which has an opening therein, sidewalls which provide said upper die support surface, and a lower die support surface, said cavity extending from said opening to said lower die support surface;
• securing at least one semiconductor die to said lower die surface;
• and
• securing at least one semiconductor die to said upper die support surface.