Power semiconductor module
OwnerYukio Sonobe, Akihiro Tamba +6inventors
InventorsYukio Sonobe, Akihiro Tamba, Kazuji Yamada, Ryuichi Saito, Masataka Sasaki, Tatsuya Shigemura, Kazuhiro Suzuki, Shigeki Sekine
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Abstract
A power semiconductor module comprises a metal base, plural wiring substrates provided on said the base, a first wiring substrate of the wiring substrates having a power circuit portion including a power semiconductor device, and substrate containing portions having a resin portion in which one of the wiring substrates is contained. The one of the wiring substrates is positioned in self-alignment on the metal substrate on the basis of an inner wall of the resin portion of the substrate-containing portion.
Claims12
A power semiconductor module comprising:
- a metal base;
- plural wiring substrates provided on said metal base, a first wiring substrate of the wiring substrates having a power circuit including a power semiconductor device;
- a substrate containing portions having a resin portion in which one of said wiring substrates is contained, and
- wherein said one of said wiring substrates is positioned in self-alignment on said metal substrate on the basis of an inner wall of said resin portion of the substrate containing portion.
Dependencies are inferred from the claim text.