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AssigneeUnited Microelectronics Corp.
InventorsChien-Hsin Lai, Jung-Nan Tseng, Huang-Yi Lin, Fu-Yang Yu
Estimating the term…
A pressure suppression device for a chemical mechanical polishing machine. The chemical mechanical polishing machine includes a polishing table and a polishing head. The polishing table has a polishing pad and a polishing gas input through which a polishing gas is charged. The polishing head holds a wafer and has a wafer gas input through which a wafer gas is charged. The pressure suppression device has a pressure releasing component and a gas input tube coupled to the wafer gas input and the pressure releasing component. When a polishing pressure applied to the polishing pad is smaller than a wafer pressure applied to the wafer, the pressure releasing component releases a part of the wafer pressure until the wafer pressure is smaller than the polishing pressure. As a result, this prevents the wafer slippage or broken wafer that occur when the wafer is blown off from the polishing head by too much wafer pressure.
A pressure suppression device for a chemical mechanical polishing machine comprising a polishing table and a polishing head, wherein the polishing table further comprises a polishing pad and a polishing gas input through which a polishing gas is charged, the polishing gas generates a polishing pressure to apply to the polishing pad, and the polishing head for holding the wafer comprises a wafer gas input through which a wafer gas is charged, and the wafer gas generates a wafer pressure to apply to the wafer, the pressure suppression device comprising:
A pressure suppression device for a chemical mechanical polishing machine comprising a polishing table and a polishing head, wherein the polishing table further comprises a polishing pad and a polishing gas input through which a polishing gas is charged, the polishing gas generates a polishing pressure to apply to the polishing pad, and the polishing head for holding the wafer comprises a wafer gas input through which a wafer gas is charged, and the wafer gas generates a wafer pressure to apply to the wafer, the pressure suppression device comprising:
A pressure suppression method for a chemical mechanical polishing machine, the chemical mechanical machine comprises a polishing table and a polishing head, the method comprising:
A pressure suppression method for a chemical mechanical machine comprising a polishing table with a polishing pad formed thereon and a polishing head for holding a wafer, the method comprising:
Dependencies are inferred from the claim text.