Metal alloy compositions and plating methods related thereto
AssigneeShipley Company, L.L.C.
InventorsAndre Egli, Anja Vinckier, Jochen Heber, Wan Zhang
Life of this patent
Estimating the term…
Abstract
The present invention provides inter alias electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer additive comprising one or more non-aromatic compounds having π electrons that can be delocalized, e.g., an α,β unsaturated system or other conjugated system that contains a proximate electron-withdrawing group. Compositions of the invention provide enhanced grain refinement and increased stability in metal plating solutions, particularly in tin and tin alloy plating formulations.
Claims26
An electroplating composition comprising:
- at least one soluble metal salt,
- an electrolyte, and
- a grain refmer/stabilizer additive comprising one or more non-aromatic compounds having π electrons that can be delocalized.
A method for depositing a solderable finish on an electronic device substrate, the method comprising:
- electrolytically depositing onto the substrate a metal from an electroplating composition that comprises at least one soluble metal salt, an electrolyte, at least one grain refiner/stabilizer additive comprising one or more non-aromatic compounds having π electrons that can be delocalized.
An article of manufacture comprising an electronic device substrate having thereon an electrolytic tin deposit obtained from an electroplating composition that comprises at least one soluble tin salt, an electrolyte, and a grain refiner/stabilizer additive comprising one or more non-aromatic compounds having π electrons that can be delocalized.
Dependencies are inferred from the claim text.