UHF ground interconnects
AssigneeLockheed Martin Corporation
InventorPeter A. Miller
Life of this patent
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Abstract
A via on a printed circuit board having a circuit has a first interconnect and a second interconnect located about at least a portion of the first interconnect. The second interconnect connects to ground of the circuit and is coaxial and substantially concentric with the first interconnect and inductively coupled with the first interconnect. A method of electrically interconnecting at a via multiple layers on a printed circuit board to provide a common ground plane for a circuit is also provided. A high speed interconnection can be attained by allowing the ground return path for a circuit carried on multiple layers of a multilayer printed circuit board to remain coupled to the signal, thereby lowering ground inductance and maintaining signal integrity, even at UHF, while minimizing costs.
Claims11
A via for use in a printed circuit board having a circuit, the via comprising:
- a first interconnect;
- and
- a second interconnect located about at least a portion of the first interconnect, the second interconnect being coaxial with the first interconnect and inductively coupled with the first interconnect, the second interconnect being connected to ground of the circuit.
A method of electrically interconnecting multiple layers on a printed circuit board to provide a common ground plane for a circuit, the method comprising:
- connecting a first layer and at least a second layer to a via disposed in a through-hole of a printed circuit board, the via comprising a first interconnect and a second interconnect located about at least a portion of the first interconnect, the second interconnect being coaxial and substantially concentric with the first interconnect and inductively coupled with the first interconnect, the second interconnect being connected to ground of the circuit.
Dependencies are inferred from the claim text.