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AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsTakayuki Nagai, Yoshio Kubo, Kunihiko Egawa, Osamu Taguchi
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A method for manufacturing a Sn based alloy containing a finely dispersed Sn-Ti compound by the steps comprising melting Sn by heating at 1300 to 1500° C in vacuum or under an inert gas atmosphere, adding 0.1 to 5% by weight of Ti followed by melting by heating, and casting the molten alloy into a copper mold directly or through a pouring cup. The Sn based alloy obtained by this method contains the Sn-Ti compound having a maximum particle diameter of 30 μm and mean particle diameter of 5 to 20 μm. A precursor of a Nb3Sn wire is also obtained by an inner diffusion method using this Sn based alloy. The Nb3Sn wire manufactured by using the Sn based alloy of the present invention exhibits excellent superconductive characteristics. The method of the present invention enables the ingot to be free from a shrinkage cavity appearing during the manufacturing process.
A Sn based alloy containing a Sn-Ti compound prepared by adding 0.1 to 5% by weight of Ti relative to the content of Sn, wherein particles of the Sn-Ti compound have a maximum diameter of 30 μm or less and a mean diameter of within a range of 5 to 20 μm.
A method for manufacturing a Sn based alloy containing a Sn-Ti compound finely dispersed therein, comprising the steps of melting Sn by heating at 1300 to 1500° C. in vacuum or under an inert gas atmosphere, adding 0.1 to 5% by weight of Ti relative to the content of Sn followed by melting the mixture by heating at 1300 to 1500° C., and casting the molten liquid into a mold made of copper.
A method for manufacturing a Sn based alloy containing a Sn-Ti compound finely dispersed therein, comprising the steps of melting Sn by heating at 1300 to 1500° C. in vacuum or under an inert gas atmosphere, adding 0.1 to 5% by weight of Ti relative to the content of Sn followed by melting the mixture by heating at 1300 to 1500° C., and casting the molten liquid into a mold made of copper through a carbon pouring cup mounted on the mold.
Dependencies are inferred from the claim text.