Substrate processing apparatus and method
AssigneeTokyo Electron Limited
InventorKouichi Itou
Life of this patent
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AssigneeTokyo Electron Limited
InventorKouichi Itou
Estimating the term…
A cleaning processing system comprises a wafer transfer device, a wafer detecting sensor for detecting a wafer, a memory for storing the position and direction of an extra wafer present inside the cleaning processing system when the power supply is cut off, an alarm device for generating an alarm in the case where the information detected by the wafer detecting sensor when the power supply to the cleaning processing system is turned on differs from the wafer information taken out of the memory, an alarm canceling section for canceling the alarm, an apparatus control section for controlling the wafer transfer device to recover the extra wafer, and a recovery start-up section for emitting an instruction to start the wafer recovery to the apparatus control section. After the alarm is canceled by the alarm canceling section and after it has been confirmed that the wafer is recovered under the state that the wafer faces in a prescribed direction, an instruction to recover the wafer is emitted from the recovery start-up section to the apparatus control section.
A substrate processing apparatus, comprising:
A substrate processing apparatus, comprising:
A substrate processing apparatus for applying a prescribed processing to a substrate, comprising:
A substrate processing apparatus for applying a prescribed processing to a substrate, comprising:
A substrate processing method in a substrate processing apparatus for applying a prescribed processing to the front surface and the back surface of a substrate, said substrate processing apparatus being provided with substrate transfer means for transferring the substrate therein, comprising the steps of:
A substrate processing method in a substrate processing apparatus for applying a prescribed processing to the front surface and the back surface of a substrate, said substrate processing apparatus being provided with substrate transfer means for transferring the substrate therein, comprising the steps of:
A substrate processing method in a substrate processing apparatus for applying a prescribed processing to the front surface and the back surface of a substrate, said substrate processing apparatus being provided with substrate transfer means for transferring the substrate therein, comprising the steps of:
A substrate processing apparatus, comprising:
A substrate processing apparatus for applying a prescribed processing to a substrate, comprising:
Dependencies are inferred from the claim text.