Electrostatic chuck cleaning method
AssigneeApplied Materials, Inc.
InventorFuminori Akiba
Life of this patent
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Abstract
An electrostatic chuck cleaning process that cleans an electrostatic chuck, equipped in a chamber, for chucking and holding a substrate. This method has (1) a plasma etching process that performs plasma etching on the electrostatic chuck, (2) a substrate mounting process that mounts a substrate on the electrostatic chuck that was subjected to plasma etching in the plasma etching process, and (3) a substrate removal process that removes the substrate that was mounted on the electrostatic chuck in the substrate mounting process.
Claims5
An electrostatic chuck cleaning method that cleans an electrostatic chuck for chucking and holding a substrate, equipped in a chamber, comprising:
- a plasma etching process that performs plasma etching on said electrostatic chuck;
- a substrate mounting process that mounts a substrate onto said electrostatic chuck that was subjected to plasma etching in said plasma etching process;
- and
- a substrate removal process that removes said substrate that was mounted onto said electrostatic chuck in said substrate mounting process.
Dependencies are inferred from the claim text.