Thin-film disposition apparatus

A thin-film deposition apparatus, comprising:

• a vacuum reaction chamber;
• and
• a dividing plate separating the vacuum reaction chamber into a plasma discharge space and a film deposition space;
• the dividing plate includes a plurality of plates laminated together at their interfacial surfaces and having a plurality of internal spaces that are connected to the film deposition space, the dividing plate further having a plurality of holes that connect the plasma discharge space to the film deposition space, and which plurality of holes are distinct from the plurality of internal spaces;
• wherein the plurality of plates are bonded together over a sufficiently large portion of the interfacial surfaces so as to prevent radicals passing through the plurality of holes from passing between any of the plurality of plates into any of the internal spaces, wherein the plurality of plates are bonded together at an outer periphery thereof and in at least some portions of the laminated plates that are within the outer periphery.

A dividing plate for a thin-film deposition chamber having a vacuum reaction chamber that includes a plasma discharge space and film deposition space, the dividing plate comprising:

• a plurality of plates laminated together at their interfacial surfaces;
• a plurality of internal spaces within the dividing plate, the internal spaces being connected to the film deposition space;
• and
• a plurality of holes extending through the dividing plates so as to connect the plasma discharge space and the film deposition space, the plurality of holes being distinct from the plurality of internal spaces;
• wherein the plurality of plates are bonded together over a sufficiently large portion of the interfacial surfaces so as to prevent radicals passing through the plurality of holes from passing between any of the plurality of plates into any of the internal spaces, wherein the plurality of plates are bonded together at an outer periphery thereof and in at least some portions of the laminated plates that are within the outer periphery.

A thin-film deposition apparatus, comprising:

• a vacuum reaction chamber;
• means for dividing the vacuum reaction chamber into a plasma discharge space and a film deposition space;
• the dividing means includes a plurality of internal spaces for retaining a precursor gas, said plurality of spaces being connected to the film deposition space;
• the dividing means further including means, distinct from the plurality of internal spaces, for communicating radicals from the plasma discharge space to the film deposition space;
• the dividing means including a plurality of plates bonded together over a sufficiently large portion of their interfacial surfaces so as to prevent radicals passing through the communicating means from passing between any of the plurality of plates into any of the internal spaces.