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AssigneeSony Corporation
InventorsKazuo Nishiyama, Yoshiyuki Yanagisawa, Toshiharu Yanagida, Masashi Enda, Yoshitaka Yoshino, Yuichi Takai, Kiyoshi Hasegawa
Estimating the term…
An electronic circuit device of a three-dimensional mounting mode capable of being produced by a simple method while suppressing the production costs and of a structure resistant to external stress, including first-mounting-board wiring portions formed on a first mounting board, first mounting parts mounted on the first mounting board, bumps formed on the first mounting board connecting to the first-mounting-board wiring portion, a protective layer formed covering the first mounting parts so that at least the portions near the tops of the bumps are exposed, a second mounting board stacked as an upper layer of the protective layer, second-mounting-board wiring portions formed on the second mounting board in order to connect to the bumps, and second mounting parts mounted connecting to the second-mounting-board wiring portions on the second mounting board at the surface of the second mounting board opposite to the protective layer side, and a method of production of the same.
A method of producing an electronic circuit device, including the steps of:
A method of producing an electronic circuit device, including the steps of:
A method of producing an electronic circuit device, including the steps of:
A method of producing an electronic circuit device, including the steps of:
Dependencies are inferred from the claim text.