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AssigneeLexmark International, Inc.
InventorsSteven Robert Komplin, Ashok Murthy, Carl Edmond Sullivan
Estimating the term…
A process is provided for forming a heater chip module comprising a carrier adapted to be secured to an ink-filled container, at least one heater chip having a base s coupled to the carrier, and at least one nozzle plate coupled to the heater chip. The carrier includes a support substrate having at least one passage which defines a path for ink to travel from the container to the heater chip. The heater chip is secured at its base to a portion of the support substrate. At least the portion of the support substrate is formed from a material having substantially the same coefficient of thermal expansion as the heater chip base. A flexible circuit is coupled to the heater chip module such as by TAB bonding or wire bonding.
A process for forming an ink jet heater chip/support substrate assembly comprising the steps of:
A process for forming an ink jet heater chip module comprising the steps of:
A process for forming an ink jet heater chip module comprising the steps of:
Dependencies are inferred from the claim text.