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US 2002/0119684 A1Published application
Surface mountable optoelectronic device
AssigneeStratos Lightware, Inc.
InventorsPatrick B. Gilliland, Robert M. Dwarkin, Carlos Jines, Raul Medina
Life of this patent
Estimating the term…
Abstract
The transceiver includes a housing, a transmitting optical sub-assembly mounted in the housing, a receiving optical sub-assembly mounted in the housing, a first electrical connector associated with the transmitting optical sub-assembly, a second electrical connector associated with the receiving optical sub-assembly, and an electromagnetic shield mounted on the housing. The housing includes a first fiber optic connector receptacle, a second fiber optic connector receptacle, and a first side, and the housing is made of an electrically conductive material.
Claims21
A device comprising:
- a housing having a first fiber optic connector receptacle and a second fiber optic connector receptacle, the housing having a first side, and the housing being made of an electrically conductive material;
- a transmitting optical sub-assembly mounted in the housing and being associated with the first fiber optic connector receptacle;
- a receiving optical sub-assembly mounted in the housing and being associated with the second fiber optic connector receptacle;
- a first electrical connector electrically associated with the transmitting optical sub-assembly and projecting from the housing, the first electrical connector having a first plurality of contacts, and wherein a first contact of the first plurality of contacts being electrically grounded to the housing;
- a second electrical connector electrically associated with the receiving optical sub-assembly and projecting from the housing, the second electrical connector having a second plurality of contacts, and wherein a second contact of the second plurality of contacts being electrically grounded to the housing, and wherein the first side of the housing, a first portion of the first plurality of contacts, and a second portion of the second plurality of contacts substantially exist in a first plane so as to be surface mountable to a host device printed circuit board;
- and
- an electro-magnetic shield mounted on the housing for preventing electro-magnetic fields from passing between the housing and a host device panel cut-out.
4 more elements
A device comprising:
- a housing having a first fiber optic connector receptacle and a second fiber optic connector receptacle, the housing having a first side, and the housing being made of an electrically conductive material;
- a transmitting optical sub-assembly mounted in the housing and being associated with the first fiber optic connector receptacle;
- a receiving optical sub-assembly mounted in the housing and being associated with the second fiber optic connector receptacle;
- a first electrical connector electrically associated with the transmitting optical sub-assembly and projecting from the housing, the first electrical connector having a first plurality of contacts, and wherein a first contact of the first plurality of contacts being electrically grounded to the housing;
- a second electrical connector electrically associated with the receiving optical sub-assembly and projecting from the housing, the second electrical connector having a second plurality of contacts, and wherein a second contact of the second plurality of contacts being electrically grounded to the housing, and wherein the first side of the housing, a first portion of the first plurality of contacts, and a second portion of the second plurality of contacts substantially exist in a first plane so as to be surface mountable to a host device printed circuit board;
- and
- an electro-magnetic shield mounted on the housing for preventing electro-magnetic fields from passing between the housing and a host device panel cut-out, and wherein
- the first plurality of conductors and the second plurality of conductors are configured so as to substantially match an impedance of the device with an impedance of the host device.
5 more elements
A device comprising:
- a housing having a first fiber optic connector receptacle and a second fiber optic connector receptacle, the housing having a first side, and the housing being made of an electrically conductive material;
- a transmitting optical sub-assembly mounted in the housing and being associated with the first fiber optic connector receptacle;
- a receiving optical sub-assembly mounted in the housing and being associated with the second fiber optic connector receptacle;
- a first electrical connector electrically associated with the transmitting optical sub-assembly and projecting from the housing, the first electrical connector having a first plurality of contacts, and wherein a first contact of the first plurality of contacts being electrically grounded to the housing;
- a second electrical connector electrically associated with the receiving optical sub-assembly and projecting from the housing, the second electrical connector having a second plurality of contacts, and wherein a second contact of the second plurality of contacts being electrically grounded to the housing, and wherein the first side of the housing, a first portion of the first plurality of contacts, and a second portion of the second plurality of contacts substantially exist in a first plane so as to be surface mountable to a host device printed circuit board;
- and
- an electro-magnetic shield mounted on the housing for preventing electro-magnetic fields from passing between the housing and a host device panel cut-out, and wherein
- the first plurality of conductors and the second plurality of conductors are configured so as to substantially match an impedance of the device with an impedance of the host device, and wherein
- a first dielectric material substantially positioned between each contact of the first plurality of contacts, and wherein
- a second dielectric material substantially positioned between each contact of the second plurality of contacts.
7 more elements
A method of mounting a transceiver to a printed circuit board of a host device, where a surface of the printed circuit board of the host device is substantially flat, the method comprising the steps of:
- placing the transceiver on the surface of the printed circuit board of the host device so that a side of the transceiver contacts the surface of the printed circuit board of the host device and so that contacts of the transceiver contact the surface of the printed circuit board of the host device;
- grounding a chassis of the transceiver to the printed circuit board of the host device;
- and
- soldering the contacts of the transceiver to the printed circuit board of the host device.
1 more element
Dependencies are inferred from the claim text.