Semiconductor device and method for making the same

A semiconductor device for photographing comprising:

• a resin housing having an opening extending between an upper surface of the resin housing and a bottom surface of the housing;
• a wire pattern made of a conductive material and molded in the resin housing, a part of the wire pattern being exposed on the bottom surface of the resin housing;
• an electronic part connected with the wire pattern in a state where the electronic part is molded in the resin housing;
• a solid-state image sensing chip which is flip chip mounted to the part of the wire pattern being exposed on the bottom surface of the resin housing;
• and
• a lens for photographing which is mounted on an upper face of the housing;
• wherein the lens for photographing and the solid-state image sensing chip are arranged in a state where a light passing through the lens for photographing is incident on a light-receiving surface of the solid-state image sensing chip through the opening of the resin housing.

A method for manufacturing a semiconductor device comprising the steps of:

• forming a wire pattern made of a conductive material on a metal board;
• connecting an electronic part with the wire pattern;
• forming a resin housing in which the electronic part and the wire pattern are molded by encapsulating the electronic part and the wire pattern on the metal board;
• exposing a part of the wire pattern by removing the metal board from the resin housing;
• and
• attaching a functional part to the resin housing, the functional part providing a designated function in cooperation with the semiconductor element.

A semiconductor device for photographing comprising:

• a lens holder having a lens for photographing;
• a resin molded body providing the lens holder;
• a solid-state image sensing chip mounted to a bottom surface of the resin molded body opposite to a surface on which the lens holder is mounted;
• and
• a board to which the resin molded body is mounted;
• wherein the board has an opening positioned at a place where the resin molded body is mounted, and the solid-state image sensing chip is mounted to the bottom surface of the resin molded body in a state where the solid-state image sensing chip is arranged in the opening.