Semiconductor device encapsulators, methods of encapsulating semiconductor devices and methods of forming electronic packages

A method of forming an electronic package, comprising:

• providing a circuit board comprising a circuit pattern;
• joining a semiconductor device to the circuit board in electrical connection with the circuit pattern;
• providing a dispensing apparatus having a plurality of dispensing orifices proximate the semiconductor device;
• dispensing liquid encapsulating material through the plurality of orifices and onto the semiconductor device;
• and
• curing the liquid encapsulating material.

A method of encapsulating at least two semiconductor devices, comprising:

• providing at least two semiconductor devices over a substrate;
• providing a dispensing apparatus having at least two dispensing orifices, a first of the at least two dispensing orifices being received proximate a first of the at least two semiconductor devices and a second of the at least two dispensing orifices being received proximate a second of the at least two semiconductor devices;
• and
• simultaneously dispensing a liquid encapsulating material through the at least two orifices and over the at least two semiconductor devices.

A method of encapsulating a plurality of semiconductor devices, comprising:

• providing a plurality of semiconductor devices over substrate;
• providing a dispensing apparatus having an array of dispensing orifice sets, individual sets of the array being in correspondence with individual semiconductor devices of the plurality of semiconductor devices;
• and
• simultaneously dispensing liquid encapsulating material through orifices of different sets.

A method of encapsulating a plurality of semiconductor devices, comprising:

• providing a plurality of semiconductor devices over substrate;
• providing a dispensing apparatus having an array of spaced dispensing orifices, individuals of the array being in correspondence with individual semiconductor devices of the plurality of semiconductor devices;
• and
• simultaneously dispensing liquid encapsulating material through at least two of the spaced dispensing orifices and onto at least two of the individual semiconductor devices.

A method of forming an electronic package, comprising:

• providing a circuit board comprising a circuit pattern;
• joining a plurality of semiconductor devices to the circuit board in electrical connection with the circuit pattern;
• providing a dispensing apparatus having a plurality of dispensing orifices proximate the semiconductor devices;
• simultaneously dispensing liquid encapsulating material through at least two of the plurality of orifices and over at least two of the semiconductor devices;
• and
• curing the liquid encapsulating material.

A method of forming an electronic package, comprising:

• providing a circuit board comprising a circuit pattern;
• joining a plurality of semiconductor devices to the circuit board in electrical connection with the circuit pattern, the semiconductor devices being arranged in a plurality of arrays;
• providing a dispensing apparatus having a plurality of dispensing orifices proximate some of the semiconductor devices, the dispensing orifices being arranged in a single array of orifice sets which is aligned with a single of the semiconductor device arrays;
• simultaneously dispensing liquid encapsulating material through the array of orifice sets and over the single array of semiconductor devices;
• moving the orifice sets to align with another of the semiconductor device arrays;
• and
• simultaneously dispensing liquid encapsulating material through the array of orifice sets and over the other array of semiconductor devices.

A method of forming an electronic package, comprising:

• providing a circuit board comprising a circuit pattern;
• joining a plurality of semiconductor devices to the circuit board in electrical connection with the circuit pattern, the semiconductor devices being arranged in a plurality of arrays;
• providing a dispensing apparatus having a plurality of spaced dispensing orifices proximate some of the semiconductor devices, the spaced dispensing orifices being arranged in a single array which is aligned with a single of the semiconductor device arrays;
• simultaneously dispensing liquid encapsulating material through the array of orifices and over the single array of semiconductor devices;
• moving the orifices to align with another of the semiconductor device arrays;
• and
• simultaneously dispensing liquid encapsulating material through the array of orifices and over the other array of semiconductor devices.

A semiconductor device encapsulator configured to encapsulate a plurality of semiconductor devices which are joined to a circuit board, the encapsulator comprising:

• at least one vessel configured for containing liquid encapsulant material;
• a dispensing apparatus having an array of dispensing orifice sets in fluid communication with the vessel, individual sets of the array being in correspondence with individual semiconductor devices of the plurality of semiconductor devices;
• and
• the device being configured to simultaneously dispense liquid encapsulating material from the vessel and through orifices of different sets to simultaneously cover different semiconductor devices with the encapsulating material.

A semiconductor device encapsulator configured to encapsulate a plurality of semiconductor devices which are joined to a circuit board and arranged in a plurality of arrays, the encapsulator comprising:

• a dispensing apparatus having a plurality of dispensing orifices, the dispensing orifices being arranged in a single array of orifice sets which is aligned with a single of the semiconductor device arrays;
• the apparatus being configured to:
• simultaneously dispense liquid encapsulating material through the array of orifice sets and over more than one of the semiconductor devices of the single array of semiconductor devices;
• move the orifice sets to align with another of the semiconductor device arrays;
• and
• simultaneously dispense liquid encapsulating material through the array of orifice sets and over more than one of the semiconductor devices of the other array of semiconductor devices.