Insert-moldable heat spreader, semiconductor device using same, and method for manufacturing such semiconductor device

A heat spreader adapted to be insert-molded with resin on a surface of a circuit board on which a semiconductor chip is mounted so that said heat spreader covers said surface of the circuit board including an upper surface of said semiconductor chip over substantially a same area as that covered with molded resin when insert-molded with resin,

• said heat spreader comprising:
• a first surface positioned at a side of said circuit board and adhered with resin when insert-molded with resin;
• and
• a second surface positioned opposite to said first surface and at least a part thereof defining an exposed surface when insert-molded with resin;
• said heat spreader further comprising:
• a first part, at the first surface thereof, defining a first gap with respect to said surface of the circuit board when insert-molded with resin and, at the second surface thereof, defining said exposed surface when insert-molded with resin;
• and
• a second part, at the first surface thereof, defining a second gap with respect to said surface of the circuit board when insert-molded with resin, said second gap being smaller than said first gap and, at the second surface thereof, being adhered to and embedded in resin when insert-molded with resin.

A semiconductor device comprising:

• a circuit board having a surface;
• a semiconductor chip mounted on said surface of the circuit board;
• and
• a heat spreader having a first, main portion which defines a first gap to said surface of the circuit board, and a second portion which defines a second gap to said surface of the circuit board, said second gap being smaller than said first gap;
• and
• a resin insert-molded with said heat spreader integrally on said surface of the circuit board so as to cover an area of said surface including an upper surface of said semiconductor chip, so that at least said second portion is embedded in said resin.

A semiconductor device comprising:

• a circuit board having a surface;
• a semiconductor chip mounted on said surface of the circuit board;
• and
• a heat spreader insert-molded with resin on a surface of a circuit board so that said heat spreader covers said surface of the circuit board including an upper surface of said semiconductor chip over substantially a same area as that covered with molded resin;
• said heat spreader comprising:
• a first surface positioned at a side of said circuit board and adhered with resin;
• and
• a second surface positioned opposite to said first surface and at least a part thereof defining an exposed surface;
• said heat spreader further comprising:
• a first part, at the first surface thereof, defining a first gap with respect to said surface of the circuit board and, at the second surface thereof, defining said exposed surface;
• and
• a second part, at the first surface thereof, defining a second gap with respect to said surface of the circuit board, said second gap being smaller than said first gap and, at the second surface thereof, being adhered to and embedded in resin;
• and
• said resin insert-molded with said heat spreader integrally on said surface of the circuit board so as to cover an area of said surface including an upper surface of said semiconductor chip, so that said second part of the heat spreader, at the first surface thereof, is adhered to and embedded in said resin.

A method for manufacturing a semiconductor device;

• said device comprising a semiconductor chip mounted on said surface of the circuit board;
• and a heat spreader insert-molded with resin on a surface of a circuit board so that said heat spreader covers said surface of the circuit board including an upper surface of said semiconductor chip over substantially a same area as that covered with molded resin, said heat spreader comprising:
• a first surface positioned at a side of said circuit board and adhered with resin;
• and a second surface positioned opposite to said first surface and at least a part thereof defining an exposed surface;
• and said heat spreader further comprising:
• a first part, at the first surface thereof, defining a first gap with respect to said surface of the circuit board and, at the second surface thereof, defining said exposed surface;
• and a second part, at the first surface thereof, defining a second gap with respect to said surface of the circuit board, said second gap being smaller than said first gap and, at the second surface thereof, being adhered to and embedded in resin:
• said method comprising:
• setting a molding component to define a mold cavity comprising a first cavity between said first surface of this heat spreader and said surface of the circuit board and a second cavity between said second surface of this heat spreader and said components, so that at least a part of said molding components is in contact with said first part, at the second surface thereof, and at least a remaining part of said molding component is in contact with a peripheral edge of said heat spreader;
• and
• injecting resin simultaneously into both said first and second cavities so that both said first and second cavities are filled with resin.