Semiconductor package using tape circuit board with a groove for preventing encapsulant from overflowing and manufacturing method thereof

A method for manufacturing a semiconductor package, the method comprising:

• (A) manufacturing a tape circuit board, comprising:
• (1) preparing an insulating tape having a window formed in a center thereof, and circuit patterns formed on an upper surface thereof, the circuit patterns having a plurality of board pads adjacent the window and a plurality of conductive ball pads electrically connected to the board pads;
• (2) forming a protection layer on the upper surface of the insulating tape except for the board pads and the conductive ball pads, wherein a groove is formed in the protection layer along a perimeter of the window by incompletely removing the protection layer so that the groove does not expose the circuit patterns;
• and
• (3) attaching an elastomer on the lower surface of the insulating tape;
• (B) attaching an active surface of a semiconductor chip to a lower surface of the elastomer in a way that electrode pads formed on the active surface of the chip are exposed through the window;
• and
• (C) electrically connecting the electrode pads to the board pads.

A method for manufacturing a tape circuit board, the method comprising:

• preparing an insulating tape having a window formed in a center thereof, and circuit patterns formed on an upper surface thereof, the circuit patterns having a plurality of board pads adjacent the window and a plurality of conductive ball pads electrically connected to the board pads;
• and
• forming a protection layer on the upper surface of the insulating tape except for the board pads and the conductive ball pads,
• wherein a groove is formed in the protection layer, the groove extending substantially around a perimeter of the window.

A tape circuit board for forming a semiconductor package, comprising:

• an insulating tape with a window formed in a center thereof;
• circuit patterns formed on an upper surface of the insulating tape, the circuit patterns having a plurality of board pads adjacent the window and a plurality of conductive ball pads connected to the board pads;
• and
• a protection layer overlying the upper surface of the insulating tape, leaving the board pads and the conductive ball pads uncovered,
• wherein a groove in the protection layer extends substantially around a perimeter of the window to prevent encapsulant overflow.

A semiconductor package comprising:

• a semiconductor chip with a plurality of electrode pads formed on an active surface thereof;
• a tape circuit board comprising:
• an insulating tape with a window formed in a center thereof,
• circuit patterns formed on an upper surface of the insulating tape, the circuit patterns having a plurality of board pads adjacent the window and a plurality of conductive ball pads connected to the board pads;
• and
• a protection layer overlying the upper surface of the insulating tape, leaving the board pads and the conductive ball pads uncovered,
• wherein the active surface of the chip is attached to a lower surface of the insulating tape and the electrode pads are exposed through the window and electrically connected to board pads, and
• wherein a groove is formed in the protection layer and formed in a substantially ring shape.