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AssigneesNorth Carolina State University, The University of North Carolina at Chapel Hill
InventorsJoseph M. DeSimone, Ruben G. Carbonell, Jonathan Kendall, Christopher L. McAdams
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A process of forming a resist image in a microelectronic substrate comprises the steps of contacting the substrate with a composition first comprising carbon dioxide and a component selected from the group consisting of at least one polymeric precursor, at least one monomer, at least one polymeric material, and mixtures thereof to deposit the component on the substrate and form a coating thereon; then imagewise exposing the coating to radiation such that exposed and unexposed coating portions are formed; then subjecting the coating to a second composition comprising carbon dioxide having such that either one of the exposed or the unexposed coating portions are removed from the substrate and the other coating portion is developed and remains on the coating to form an image thereon.
A process of forming a resist image in a microelectronic substrate, said process comprising the steps of:
A process of forming integrated circuits comprising the steps of:
A process of forming integrated circuits comprising the steps of:
Dependencies are inferred from the claim text.