Low temperature die attaching material for BOC packages
AssigneeMicron Technology, Inc.
InventorTongbi Jiang
Life of this patent
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Abstract
An apparatus and method is provided for forming a board-on-chip (BOC) package. An adhesive material including a carrier and microcapsules distributed in the carrier is used to bond a semiconductor component to a mounting surface in a BOC package. The microcapsules contain a hardener and/or a catalyst that, when combined with the carrier, initiate a bonding reaction. The contents of the microcapsules are released via application of an external influence, such as pressure or heat, when the bonding reaction is desired to begin. The use of microcapsules permits the formulation of adhesive blends with a substantially increased pot life, increased stability and reliability at high temperatures, and favorable low temperature reaction and bonding characteristics.
Claims57
A method of attaching semiconductor components, comprising:
- interposing an adhesive material between a semiconductor component and a mounting surface, said adhesive material including a carrier and microcapsules distributed in said carrier;
- releasing contents of said microcapsules into said carrier to activate said adhesive material;
- bonding said semiconductor component to said mounting surface with said activated adhesive material.
An adhesive material, comprising:
- a carrier;
- and
- a plurality of microcapsules distributed in said carrier;
- whereby said carrier and contents of said microcapsules combine upon application of an external influence so as to permit said adhesive material to create a bond.
A board-on-chip (BOC) package, comprising:
- a semiconductor component;
- a substrate;
- an adhesive material interposed between and attaching said semiconductor component and said substrate, said adhesive material comprising:
- a carrier;
- and
- a plurality of microcapsules distributed in said carrier;
- whereby said carrier and contents of said microcapsules combine upon application of an external influence so as to permit said adhesive material to create a bond.
A processor system, comprising:
- a processor;
- and
- a semiconductor device connected to said processor, at least one of said processor and said semiconductor device having a semiconductor package including an adhesive material comprising:
- a carrier;
- and
- a plurality of microcapsules distributed in said carrier;
- whereby said carrier and contents of said microcapsules combine upon application of an external influence so as to permit said adhesive material to create a bond.
Dependencies are inferred from the claim text.