Cooling module grounding structure and method and electronic apparatus with the structure
AssigneeKabushiki Kaisha Toshiba
InventorKiyokazu Yoneda
Life of this patent
Estimating the term…
Abstract
An electronic component is mounted on a printed circuit board, and a metal cooling module for cooling the electronic component is opposed to the electronic component. A vertical support mechanism supports the cooling module such that the cooling module is kept in pressure contact with the electronic component, the pressure being exerted perpendicular to the surface of the printed circuit board and falling within a predetermined range. The cooling module is grounded via an elastic member having electrical conductivity.
Claims15
A grounding structure for a cooling module, comprising:
- a printed circuit board installed in an electronic apparatus;
- an electronic component mounted on the printed circuit board;
- a metal cooling module opposed to the electronic component to cool the electronic component;
- a vertical support mechanism which supports the cooling module such that the cooling module is kept in pressure contact with the electronic component, the pressure being exerted perpendicular to a surface of the printed circuit board and falling within a predetermined range;
- and
- a ground portion electrically grounding the cooling module.
An electronic apparatus comprising:
- an apparatus body;
- a printed circuit board installed in the apparatus body and provided with an electronic component;
- a metal cooling module installed in the apparatus body and opposed to the electronic component, the metal cooling module being configured to cool the electronic component;
- a vertical support mechanism which supports the cooling module such that the cooling module is kept in pressure contact with the electronic component, the pressure being exerted perpendicular to the surface of the printed circuit board and falling within a predetermined range;
- and
- a ground portion electrically grounding the cooling module.
A method of grounding a cooling module, comprising:
- preparing a printed circuit board on which an electronic component is mounted;
- securing a metal cooling module, configured to cool the electronic component, to the printed circuit board by a force exerted perpendicular to the printed circuit board such that the cooling module is kept in pressure contact with the electronic component, the pressure falling within a predetermined range;
- and
- pressing and fixing the cooling module by a force exerted parallel to the printed circuit board, thereby connecting the cooling module to a ground area on the printed circuit board to ground the cooling module.
A method of grounding a cooling module, comprising:
- preparing a printed circuit board on which an electronic component is mounted;
- arranging the printed circuit board in an apparatus body of an electronic apparatus;
- securing a metal cooling module, configured to cool the electronic component, to the printed circuit board by a force exerted perpendicular to the printed circuit board such that the cooling module is kept in pressure contact with the electronic component, the pressure falling within a predetermined range;
- and
- pressing and fixing the cooling module by a force exerted parallel to the printed circuit board, thereby connecting the cooling module to a frame ground on the apparatus body to ground the cooling module.
Dependencies are inferred from the claim text.