US 2002/0118522 A1Published application

Ball grid array package with interdigitated power ring and ground ring

AssigneeSiliconware Precision Industries Co., Ltd.

InventorsTzong-Da Ho, Chih-Chin Liao, Chien-Te Chen

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Abstract

A BGA (Ball Grid Array) package is proposed, which is characterized by the provision of an interdigitated power/ground ring layout scheme. By this layout scheme, the power ring and the ground ring are each formed with a line portion and a plurality of toothed portions; with the toothed portions of the power ring being are interdigitated with the toothed portions of the ground ring. Moreover, the power/ground vias are all connected to the toothed portions of the power ring and the ground ring, thereby leaving the line portions of the power ring and the ground ring unoccupied by the power/ground vias, allowing the routability of power/ground wires to be higher than the prior art. Moreover, solder mask is formed in such a manner as to cover all the toothed portions of the ground ring, so that power wires can be prevented from being short-circuited to the ground ring due to sagging. Further, the toothed portions of the power ring and the ground ring are large in area, whereby two or more power vias or ground vias can be gathered together to increase the overall electrical performance, and whereby the packaged chip can be increased in heat-dissipation efficiency.

Claims10

Dependent claims

A BGA package, which comprises:

(a) a substrate having a front side and a back side;
(b) a first electrically-conductive ring formed over the front side of the substrate;
the first electrically-conductive ring being formed with a line portion and a plurality of toothed portions along the line portion thereof,
(c) a second electrically-conductive ring arranged alongside the first electrically-conductive ring;
the second electrically-conductive ring being formed with a line portion and a plurality of toothed portions along the line portion thereof and interdigitated with the toothed portions of the first electrically-conductive ring;
(d) a plurality of vias penetrating through the substrate, including:
a subgroup of first vias which are connected to the toothed portions of the first electrically-conductive ring;
and
a subgroup of second vias which are connected to the toothed portions of the second electrically-conductive ring;
(e) a solder mask formed over the front side of the substrate for electrically masking the first electrically-conductive ring and the second electrically-conductive ring,
(f) a semiconductor chip mounted over the front side of the substrate, the semiconductor chip having a plurality of first pads and second pads;
and
(g) a set of bonding wires, including:
a subset of first wires for connecting the first pads of the semiconductor chip to the line portion of the first electrically-conductive ring;
and
a subset of second wires for connecting the second pads of the semiconductor chip to the line portion of the second electrically-conductive ring.

13 more elements

Dependencies are inferred from the claim text.