Conductive member grid array interface for mirror array drive apparatus

Rotatable optical mirror apparatus having reduced internal wiring connections comprising:

• a ball grid array printed circuit board (BGA-PCB) having a top side and a connecting side, said top side including a first plurality of conductive member connecting points and said connecting side including connections for receiving and sending electrical signals;
• at least one drive coil module located on said top side of said BGA-PCB, said drive coil module comprising two coils and said drive coil module further including input connections for said two drive coils;
• a support printed circuit board having a device side and a backside, said backside including a second plurality of contact points and defining an area for receiving said drive coil module, said device support printed circuit board mounted to said BGA-PCB to cover said drive coil module such that said second plurality of contact points make electrical contact with selected ones of said first plurality of conductive ball connection points;
• a mirror mounted to said device side of said support printed circuit board above said drive coil module, said mirror rotatable about an axis in response to a magnetic field;
• a pair of permanent magnets attached to said mirror one each proximate each coil of said drive coil module;
• and
• mirror positioning sensing circuitry attached to said device side of said support printed circuit board.

An array of rotatable mirrors having reduced internal wiring connection comprising:

• a ball grid array printed circuit board (BGA-PCB) having a top side and a connecting side, said top side including a first plurality of conductive ball connecting points and said connecting side including a plurality of connections for receiving and sending electrical signals;
• an array of drive coil modules located on said top side of said BGA-PCB, each of said modules including a pair of coils and having input connections for each of said drive coils;
• a support printed circuit board having a device side and a backside, said backside including a second plurality of contact points and defining areas for receiving said array of drive coil modules, said support printed circuit board mounted to said BGA-PCB to cover said array of drive coil modules such that said second plurality of contact points make electrical contact with selected ones of said first plurality of conductive ball connection points;
• an array of mirrors mounted to said device side of said support printed circuit board, one each above a corresponding one of said drive coil modules and each of said mirrors rotatable about an axis in response to a magnetic field;
• a pair of permanent magnets attached to each of said mirrors, one each proximate each coil of said corresponding drive coil module;
• and
• each mirror further comprising mirror positioning sensing circuitry attached to said device side of said support printed circuit board.